Inventor · disambiguated record
Takashi Ikari
Also filed as: IKARI TAKASHI
1 granted patent·1 pending application·12 citations·filing 2000–2004
37Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD1
Top patents by PatentIndex Score
2 records- 0167US6702175B1Method of soldering using lead-free solder and bonded article prepared through soldering by the methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Mar 9, 2004·12 cites·14 claims
- 0237US2004144829A1Method of soldering lead-free solder, and joined object soldered by the soldering methodFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →