Inventor · disambiguated record
Tadaharu Ikeda
Also filed as: IKEDA TADAHARU
5 granted patents·9 pending applications·62 citations·filing 1995–2025
79Inventor score
Top patents by PatentIndex Score
14 records- 0174US8794130B2Arrangement for a grillIKEDA TADAHARU·Filed 2011·Granted Aug 5, 2014·7 cites·12 claims
- 0267US7910638B2Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2009·Granted Mar 22, 2011·1 cites·17 claims
- 0367US5827908ANaphthalene and or biphenyl skeleton containing epoxy resin compositionSHINETSU CHEMICAL CO·Filed 1997·Granted Oct 27, 1998·38 cites·17 claims
- 0466US9277840B2Arrangement introduced in a grill raising mechanismIKEDA TADAHARU·Filed 2009·Granted Mar 8, 2016·5 cites·1 claims
- 0565US2025140438A1Insulating coating material for coating electric wire, insulated wire, coil, and electric or electronic deviceSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 0664US2023140237A1Heat-curable maleimide resin composition, film, prepreg, laminate and printed-wiring boardSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 0762US2025084216A1Curable maleimide resin composition, adhesive, primer, chip coating agent, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 0862US2023040536A1Photocurable maleimide resin compositionSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 0959US2025296294A1Copper foil with resin, and copper-clad laminate and printed wiring board using the sameSHINETSU CHEMICAL CO·Filed 2025·Application pending·0 cites
- 1053US2023416466A1Curable resin composition, semiconductor encapsulation material, adhesive, adhesive film, prepreg, interlayer insulating material, and printed-wiring boardSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 1142US2008255283A1Thermosetting epoxy resin composition and semiconductor deviceAOKI TAKAYUKI·Filed 2008·Application pending·0 cites
- 1240US5731370ASemiconductor encapsulating epoxy resin compositions with 2-phenyl-4,5-dihydroxymethylimidazole curing acceleratorSHINETSU CHEMICAL CO·Filed 1995·Granted Mar 24, 1998·11 cites·8 claims
- 1338US2008141869A1Arrangement For a GrillIKEDA TADAHARU·Filed 2004·Application pending·0 cites
- 1432US2016251511A1Resin composition for encapsulating a semiconductor element and a semiconductor deviceSHINETSU CHEMICAL CO·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →