Inventor · disambiguated record
Takuji Ikeya
Also filed as: IKEYA TAKUJI
1 granted patent·5 pending applications·0 citations·filing 2016–2023
7Inventor score
Top patents by PatentIndex Score
6 records- 0166US2025297110A1Resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 0265US2025326925A1Support body-equipped resin film, manufacturing method for printed wiring board, and manufacturing method for semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 0364US2025250430A1Resin composition, resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 0452US2025174506A1Resin composition, resin film, printed circuit board, and semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 0535US10825694B2Method for manufacturing electronic component, resin composition for temporary protection, and resin film for temporary protectionHITACHI CHEMICAL CO LTD·Filed 2018·Granted Nov 3, 2020·0 cites·20 claims
- 0629US2019275763A1Mold release sheet for semiconductor compression molding and semiconductor package which is molded using sameHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →