Inventor · disambiguated record
Takashi Imoto
Also filed as: IMOTO TAKASHI
27 granted patents·20 pending applications·258 citations·filing 2000–2022
96Inventor score
Top patents by PatentIndex Score
47 records- 0193US6469374B1Superposed printed substrates and insulating substrates having semiconductor elements insideTOSHIBA KK·Filed 2000·Granted Oct 22, 2002·95 cites·14 claims
- 0290US8896111B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2013·Granted Nov 25, 2014·23 cites·13 claims
- 0383US7118294B2Optical semiconductor module and its manufacturing methodTOSHIBA KK·Filed 2004·Granted Oct 10, 2006·23 cites·4 claims
- 0481US7202563B2Semiconductor device package having a semiconductor element with resinTOSHIBA KK·Filed 2005·Granted Apr 10, 2007·7 cites·12 claims
- 0579US9209053B2Manufacturing method of a conductive shield layer in semiconductor deviceTOSHIBA KK·Filed 2014·Granted Dec 8, 2015·7 cites·10 claims
- 0677US7932605B2Semiconductor device and manufacturing method thereforTOSHIBA KK·Filed 2007·Granted Apr 26, 2011·6 cites·13 claims
- 0775US7682692B2Pressure-sensitive adhesive productNITTO DENKO CORP·Filed 2006·Granted Mar 23, 2010·9 cites·9 claims
- 0875US6734541B2Semiconductor laminated moduleTOSHIBA KK·Filed 2002·Granted May 11, 2004·26 cites·8 claims
- 0973US7352052B2Semiconductor device and manufacturing method thereforTOSHIBA KK·Filed 2004·Granted Apr 1, 2008·16 cites·4 claims
- 1071US7158243B2Printing apparatus and printing system, control method, storage medium and programCANON KK·Filed 2001·Granted Jan 2, 2007·18 cites·28 claims
- 1169US7405159B2Method of fabricating a semiconductor device package having a semiconductor element with a roughened surfaceTOSHIBA KK·Filed 2007·Granted Jul 29, 2008·3 cites·22 claims
- 1267US9824905B2Semiconductor manufacturing device and semiconductor manufacturing methodTOSHIBA MEMORY CORP·Filed 2014·Granted Nov 21, 2017·0 cites·20 claims
- 1366US9385090B2Semiconductor device and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2014·Granted Jul 5, 2016·2 cites·11 claims
- 1466US7255493B2Optical semiconductor module and its manufacturing methodTOSHIBA KK·Filed 2006·Granted Aug 14, 2007·3 cites·18 claims
- 1566US2021238382A1Flame retardant coating filmNITTO DENKO CORP·Filed 2019·Application pending·0 cites
- 1666US2021230483A1Flame retardant materialNITTO DENKO CORP·Filed 2019·Application pending·0 cites
- 1765US7298035B2Semiconductor device and a method of assembling a semiconductor deviceTOSHIBA KK·Filed 2005·Granted Nov 20, 2007·3 cites·9 claims
- 1863US8237295B2Semiconductor device, method for manufacturing semiconductor device, and manufacturing apparatus for semiconductor deviceSANO YUICHI·Filed 2011·Granted Aug 7, 2012·2 cites·20 claims
- 1962US7497535B2Print control apparatus, print control method thereof, control program, printer driver, printer, and computer readable storage mediumCANON KK·Filed 2006·Granted Mar 3, 2009·2 cites·20 claims
- 2061US10799156B2Sheet for identificationNITTO DENKO CORP·Filed 2016·Granted Oct 13, 2020·0 cites·14 claims
- 2160US11545869B2Motor having frame with axial vent holeEXEDY CORP·Filed 2021·Granted Jan 3, 2023·0 cites·10 claims
- 2256US2009035492A1Laser marking labelNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 2355US2023188016A1Drone motorEXEDY CORP·Filed 2022·Application pending·0 cites
- 2454US11715701B2Semiconductor device and method of inspecting the sameTOSHIBA MEMORY CORP·Filed 2019·Granted Aug 1, 2023·0 cites·17 claims
- 2554US7423772B2Information processing apparatus, job processing method and program, and computer-readable memory mediumCANON KK·Filed 2003·Granted Sep 9, 2008·4 cites·10 claims
- 2654US6617678B2Semiconductor deviceTOSHIBA KK·Filed 2002·Granted Sep 9, 2003·6 cites·30 claims
- 2752US7608911B2Semiconductor device package having a semiconductor element with a roughened surfaceTOSHIBA KK·Filed 2008·Granted Oct 27, 2009·0 cites·13 claims
- 2852US2015070046A1Semiconductor device and method of inspecting the sameTOSHIBA KK·Filed 2014·Application pending·0 cites
- 2950US2006154056A1Pressure-sensitive adhesive product and substrate for pressure-sensitive adhesive productNITTO DENKO CORP·Filed 2006·Application pending·0 cites
- 3050US2008121128A1Cushioning sheet, printing apparatus and printing methodNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 3149US2021115217A1Flame retardant materialNITTO DENKO CORP·Filed 2019·Application pending·0 cites
- 3248US6861738B2Laminated-chip semiconductor deviceTOSHIBA KK·Filed 2002·Granted Mar 1, 2005·3 cites·20 claims
- 3347US2019048232A1Sheet for identificationNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 3447US2008012892A1Printing apparatus, information processing apparatus, control method therefor, printing system, and programCANON KK·Filed 2007·Application pending·0 cites
- 3546US9458535B2Semiconductor manufacturing device and semiconductor manufacturing methodTOSHIBA KK·Filed 2014·Granted Oct 4, 2016·0 cites·18 claims
- 3645US10312197B2Method of manufacturing semiconductor device and semiconductor deviceTOSHIBA MEMORY CORP·Filed 2014·Granted Jun 4, 2019·0 cites·19 claims
- 3744US2005254084A1Notifying method, information processing apparatus, and control programCANON KK·Filed 2003·Application pending·0 cites
- 3844US2013100490A1Management apparatus, management method, and computer-readable mediumCANON KK·Filed 2012·Application pending·0 cites
- 3943US2015170988A1Method of manufacturing semiconductor apparatusTOSHIBA KK·Filed 2014·Application pending·0 cites
- 4041US2006270118A1Surface mount type semiconductor device and method of manufacturing the sameOKURA HIROYUKI·Filed 2006·Application pending·0 cites
- 4141US2018219719A1Information processing method and serverCANON KK·Filed 2017·Application pending·0 cites
- 4240US9207889B2Information processing apparatus, information processing method, and storage mediumIMOTO TAKASHI·Filed 2012·Granted Dec 8, 2015·0 cites·15 claims
- 4340US2015171056A1Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 4438US2012153471A1Semiconductor device and semiconductor packageWATANABE TAKESHI·Filed 2011·Application pending·0 cites
- 4535US2012286411A1Semiconductor device and manufacturing method thereof, and semiconductor module using the sameWATANABE TAKESHI·Filed 2012·Application pending·0 cites
- 4631US2013062758A1Semiconductor deviceIMOTO TAKASHI·Filed 2012·Application pending·0 cites
- 4730US2011304050A1Semiconductor apparatusIMOTO TAKASHI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →