Inventor · disambiguated record
Takehito Inaba
Also filed as: INABA TAKEHITO
10 granted patents·2 pending applications·246 citations·filing 1995–2004
91Inventor score
Top patents by PatentIndex Score
12 records- 0181US5635220AMolding die for sealing semiconductor device with reduced resin burrsNEC CORP·Filed 1995·Granted Jun 3, 1997·52 cites·5 claims
- 0278US6166443ASemiconductor device with reduced thicknessNEC CORP·Filed 1999·Granted Dec 26, 2000·58 cites·12 claims
- 0367US7253363B2Circuit boardNEC ELECTRONICS CORP·Filed 2004·Granted Aug 7, 2007·14 cites·9 claims
- 0465US6815619B2Circuit boardNEC ELECTRONICS CORP·Filed 2001·Granted Nov 9, 2004·13 cites·3 claims
- 0563US6093958ALead-on-chip type semiconductor device having thin plate and method for manufacturing the sameNEC CORP·Filed 1999·Granted Jul 25, 2000·29 cites·10 claims
- 0656US6265760B1Semiconductor device, and semiconductor device with die pad and protruding chip lead frame and method of manufacturing the sameNEC CORP·Filed 1999·Granted Jul 24, 2001·22 cites·10 claims
- 0756US6054753APlastic-encapsulated semiconductor device equipped with LOC package structureNEC CORP·Filed 1998·Granted Apr 25, 2000·23 cites·14 claims
- 0850US5757067AResin-sealed type semiconductor deviceNEC CORP·Filed 1996·Granted May 26, 1998·17 cites·10 claims
- 0947US6255742B1Semiconductor package incorporating heat dispersion plate inside resin moldingNEC CORP·Filed 1998·Granted Jul 3, 2001·15 cites·5 claims
- 1045US2005166276A1Light-repressible promotersFiled 2004·Application pending·0 cites
- 1128US6259152B1Hybrid leadframe having conductive leads less deformable and semiconductor device using the sameNEC CORP·Filed 1999·Granted Jul 10, 2001·3 cites·16 claims
- 1228US2001020734A1Management of a lateral deflection amount of a metal wire in a semiconductor deviceFiled 1998·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →