Inventor · disambiguated record
Takeo Ishibashi
Also filed as: ISHIBASHI TAKEO
25 granted patents·14 pending applications·926 citations·filing 1991–2010
97Inventor score
Files withMITSUBISHI ELECTRIC CORP16RENESAS TECH CORP15ISHIBASHI TAKEO3RENESAS ELECTRONICS CORP2HOKURIKU PHARMACEUTICAL1
Top patents by PatentIndex Score
39 records- 0197US6319853B1Method of manufacturing a semiconductor device using a minute resist pattern, and a semiconductor device manufactured therebyMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Nov 20, 2001·136 cites·20 claims
- 0295US5858620ASemiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Jan 12, 1999·267 cites·31 claims
- 0393US8092703B2Manufacturing method of semiconductor deviceISHIBASHI TAKEO·Filed 2007·Granted Jan 10, 2012·40 cites·18 claims
- 0493US6579657B1Material for forming a fine pattern and method for manufacturing a semiconductor device using the sameMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Jun 17, 2003·169 cites·6 claims
- 0589US7459265B2Pattern forming method, semiconductor device manufacturing method and exposure mask setRENESAS TECH CORP·Filed 2005·Granted Dec 2, 2008·10 cites·13 claims
- 0686US6593063B1Method of manufacturing a semiconductor device having an improved fine structureMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jul 15, 2003·42 cites·7 claims
- 0784US6376157B1Method of manufacturing a semiconductor device, chemical solution to form fine pattern, and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Apr 23, 2002·26 cites·4 claims
- 0883US6180320B1Method of manufacturing a semiconductor device having a fine pattern, and semiconductor device manufactured therebyMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jan 30, 2001·70 cites·17 claims
- 0980US7670756B2Pattern forming method, semiconductor device manufacturing method and exposure mask setRENESAS TECH CORP·Filed 2008·Granted Mar 2, 2010·4 cites·11 claims
- 1080US5451479AMethod of forming a pattern of a multilayer type semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Sep 19, 1995·36 cites·21 claims
- 1177US8017305B2Pattern forming method, semiconductor device manufacturing method and exposure mask setRENESAS ELECTRONICS CORP·Filed 2010·Granted Sep 13, 2011·2 cites·7 claims
- 1275US8679727B2Developing method for immersion lithography, solvent used for the developing method and electronic device using the developing methodTERAI MAMORU·Filed 2009·Granted Mar 25, 2014·4 cites·8 claims
- 1371US8178983B2Water repellant composition for substrate to be exposed, method for forming resist pattern, electronic device produced by the formation method, treatment method for imparting water repellency to substrate to be exposed, water repellant set for substrate to be exposed, and treatment method for imparting water repellency to substrate to be exposed using the sameISHIBASHI TAKEO·Filed 2009·Granted May 15, 2012·3 cites·14 claims
- 1469US7727709B2Method of forming resist pattern and method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Jun 1, 2010·2 cites·8 claims
- 1569US6815142B1Method for forming resist pattern, and overlying layer material and semiconductor device used for forming resist patternRENESAS TECH CORP·Filed 2000·Granted Nov 9, 2004·12 cites·13 claims
- 1662US6589880B2Fine pattern formation method and semiconductor device or liquid crystal device manufacturing method employing this methodMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jul 8, 2003·8 cites·9 claims
- 1758US6566040B1Method of manufacturing a semiconductor device and semiconductor device manufactured by the methodMITSUBISHI ELECTRIC CORP·Filed 1999·Granted May 20, 2003·25 cites·17 claims
- 1857US7935636B2Method of fabricating semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted May 3, 2011·0 cites·5 claims
- 1953US7544619B2Method of fabricating semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Jun 9, 2009·0 cites·9 claims
- 2051US7030007B2Via-filling material and process for fabricating semiconductor integrated circuit using the materialMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Apr 18, 2006·3 cites·6 claims
- 2150US5554489AMethod of forming a fine resist pattern using an alkaline film covered photoresistMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Sep 10, 1996·23 cites·13 claims
- 2248US2006246380A1Micropattern forming material and method for forming micropatternRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 2347US6171761B1Resist pattern forming method utilizing multiple baking and partial development stepsMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jan 9, 2001·13 cites·26 claims
- 2447US2010203456A1Method of forming resist pattern and method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2010·Application pending·0 cites
- 2545US2008194109A1Method of fabricating a semiconductor deviceRENESAS TECH CORP·Filed 2008·Application pending·0 cites
- 2644US5213806APharmaceutical composition comprising calcium polycarbophilHOKURIKU PHARMACEUTICAL·Filed 1991·Granted May 25, 1993·12 cites·6 claims
- 2743US2007128559A1Material for forming fine pattern, method of forming fine pattern, method of manufacturing electronic device using the same, and electronic device manufactured from the sameRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 2843US2009039519A1Semiconductor device, photomask, semiconductor device production method, and pattern layout methodPOWERCHIP SEMICONDUCTOR CORP·Filed 2008·Application pending·0 cites
- 2943US2007076203A1Exposure apparatusRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 3042US6374397B1Lot determination apparatus, lot determination method, and recording medium for storing the methodMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Apr 16, 2002·12 cites·6 claims
- 3142US2008241489A1Method of forming resist pattern and semiconductor device manufactured with the sameRENESAS TECH CORP·Filed 2008·Application pending·0 cites
- 3241US2004048200A1Method for forming fine pattern on substrate by using resist pattern, and resist surface treatment agentRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 3341US2004072096A1Micropattern forming material and fine structure forming methodRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 3438US6133138AMethod of manufacturing semiconductor device having multilayer interconnection structureMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Oct 17, 2000·7 cites·10 claims
- 3538US2004018646A1Resist pattern formation methodMITSUBISHI ELECTRIC CORP·Filed 2003·Application pending·0 cites
- 3638US2008044759A1Fine Pattern Forming Material, Method Of Forming Fine Resist Pattern And Electronic DeviceISHIBASHI TAKEO·Filed 2005·Application pending·0 cites
- 3737US2004029047A1Micropattern forming material, micropattern forming method and method for manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 3836US2001055730A1Method of manufacturing a semiconductor devices, embedding material for use therewith, and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Application pending·0 cites
- 3936US2004087138A1Method for manufacturing buried wiring structureRENESAS TECH CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →