Inventor · disambiguated record
Taejun Jeon
Also filed as: JEON TAEJUN
4 granted patents·10 pending applications·0 citations·filing 2022–2025
54Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD14
Top patents by PatentIndex Score
14 records- 0165US2025253163A1Molded product for semiconductor strip and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0262US12463126B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 0362US12308253B2Molded product for semiconductor strip and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 0460US2025218800A1Semiconductor device, semiconductor package, and printed circuit board having a patternSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0558US2025046663A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0657US12205925B2Semiconductor package having package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 21, 2025·0 cites·20 claims
- 0757US2025125229A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0856US2024420972A1Semiconductor molding apparatus and compression molding method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0955US2025329691A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1054US12400970B2Semiconductor package including electromagnetic shield structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 1154US2024096748A1Chip protection deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1253US2024079342A1Semiconductor package and a method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1352US2024128190A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1452US2025201641A1Semiconductor packages having a substrate with connecting portionsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Taejun Jeon files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →