Inventor · disambiguated record
Taesung Jeong
Also filed as: JEONG TAESUNG
6 granted patents·5 pending applications·7 citations·filing 2011–2025
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
11 records- 0190US12334445B2Method of fabricating a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 17, 2025·1 cites·20 claims
- 0290US11784129B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 10, 2023·2 cites·15 claims
- 0383US11088115B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 10, 2021·4 cites·19 claims
- 0477US2025279366A1Method of fabricating a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0576US2025140755A1Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0664US12218099B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 4, 2025·0 cites·16 claims
- 0762US12453107B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 0852US2023223353A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0948US2015022984A1Embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1043US11676915B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·18 claims
- 1140US2011290540A1Embedded printed circuit board and method of manufacturing the sameJUNG HYUNGMI·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Taesung Jeong files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →