Inventor · disambiguated record
Takayuki Kai
Also filed as: KAI TAKAYUKI
20 granted patents·10 pending applications·183 citations·filing 1985–2024
93Inventor score
Files withKAI TAKAYUKI5MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4MITSUBISHI ELECTRIC CORP3DAIWA CAN CO LTD2OKI ELECTRIC IND CO LTD2
Top patents by PatentIndex Score
30 records- 0196US7509859B2Acceleration sensor with redundant contact holesOKI SEMICONDUCTOR CO LTD·Filed 2007·Granted Mar 31, 2009·49 cites·17 claims
- 0296US7322241B2Acceleration sensor with redundant contact holesOKI ELECTRIC IND CO LTD·Filed 2006·Granted Jan 29, 2008·56 cites·14 claims
- 0389US7389691B2Acceleration sensorOKI ELECTRIC IND CO LTD·Filed 2005·Granted Jun 24, 2008·21 cites·18 claims
- 0483US8450836B2Semiconductor deviceUEMURA SHINICHIRO·Filed 2011·Granted May 28, 2013·11 cites·18 claims
- 0574US8324685B2Semiconductor device having a fin-type semiconductor regionOKUMURA TOMOHIRO·Filed 2010·Granted Dec 4, 2012·3 cites·8 claims
- 0673US6905625B2Plasma processing method and apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jun 14, 2005·9 cites·30 claims
- 0772US7705412B2SOI substrate and semiconductor acceleration sensor using the sameOKI SEMICONDUCTOR CO LTD·Filed 2008·Granted Apr 27, 2010·4 cites·2 claims
- 0871US8471367B2Semiconductor device and method for manufacturing semiconductor deviceSAITO DAISHIRO·Filed 2010·Granted Jun 25, 2013·6 cites·15 claims
- 0968US2024283222A1Light emitting device, laser processing system, method for manufacturing light emitting device, and method for manufacturing laser processing systemPANASONIC HOLDINGS CORP·Filed 2024·Application pending·0 cites
- 1066US11493743B2Optical unit for laser processing system and laser processing systemPANASONIC IP MAN CO LTD·Filed 2020·Granted Nov 8, 2022·0 cites·8 claims
- 1163US8067812B2Acceleration sensor and method of producing the sameKAI TAKAYUKI·Filed 2007·Granted Nov 29, 2011·5 cites·12 claims
- 1259US7406925B2Plasma processing method and apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Aug 5, 2008·3 cites·3 claims
- 1355US2024371557A1Solenoid and switchMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1454US12205785B2Switchgear and power converterMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Jan 21, 2025·0 cites·11 claims
- 1550US6830653B2Plasma processing method and apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 14, 2004·1 cites·6 claims
- 1647US7331306B2Plasma processing method and apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Feb 19, 2008·0 cites·10 claims
- 1746US8121308B2Arrangement structure of sound system in motorcycleKAI TAKAYUKI·Filed 2008·Granted Feb 21, 2012·0 cites·20 claims
- 1846US4862596AApparatus for measuring size of seamed portion of cansDAIWA CAN CO LTD·Filed 1988·Granted Sep 5, 1989·11 cites·8 claims
- 1946US2010095889A1Plasma doping apparatusKAI TAKAYUKI·Filed 2009·Application pending·0 cites
- 2045US2010009469A1Plasma doping method and apparatusKAI TAKAYUKI·Filed 2009·Application pending·0 cites
- 2144US2024113515A1High-speed introduction device, power conversion device and switchgearMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2244US2005252700A1Powered manual propelling vehicleKITAUCHI CHIN·Filed 2003·Application pending·0 cites
- 2343US2011057326A1Method for forming through electrode and semiconductor deviceKAI TAKAYUKI·Filed 2009·Application pending·0 cites
- 2441US6869210B2Storage box illumination device for compact vehiclesHONDA MOTOR CO LTD·Filed 2002·Granted Mar 22, 2005·0 cites·12 claims
- 2540US10218243B2Motor structure for electrolytic corrosion protection of bearingTOP CO LTD·Filed 2015·Granted Feb 26, 2019·0 cites·12 claims
- 2638US10211248B2Circuit substrate, image sensor, and electronic apparatusSONY CORP·Filed 2015·Granted Feb 19, 2019·0 cites·20 claims
- 2737US2017201135A1Stator and rotary machineTOP CO LTD·Filed 2015·Application pending·0 cites
- 2836US2002038791A1Plasma processing method and apparatusFiled 2001·Application pending·0 cites
- 2934US4649251ABlank guide device of resistance welding machine for seam welding of can bodyDAIWA CAN CO LTD·Filed 1985·Granted Mar 10, 1987·4 cites·1 claims
- 3029US2012119384A1Semiconductor device and manufacturing method thereofTAKII YOSHIMASA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →