Inventor · disambiguated record
Taegyu Kang
Also filed as: KANG TAEGYU
4 granted patents·19 pending applications·18 citations·filing 2006–2025
67Inventor score
Files withSAMSUNG ELECTRONICS CO LTD18KOREA ELECTRONICS TELECOMM2KIM DAEHO1KOREA ADVANCED INST SCI & TECH1STATS CHIPPAC LTD1
Top patents by PatentIndex Score
23 records- 0178US8630549B2Visible light communication apparatus and visible light communciation methodKIM DAEHO·Filed 2009·Granted Jan 14, 2014·15 cites·8 claims
- 0261US2025254865A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0361US2025254864A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0461US2025185233A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0560US9242595B2Apparatus and method for controlling taillight of vehicle, capable of brightness control and visible light wireless communicationKOREA ELECTRONICS TELECOMM·Filed 2014·Granted Jan 26, 2016·3 cites·16 claims
- 0659US2025107071A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0759US2025107075A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0858US2023276614A1Method of manufacturing semiconductor memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0956US11653490B2Semiconductor memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 1056US2025351336A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1155US2025205797A1Method of soldering electronic devices and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1254US2025098153A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1353US2024147707A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1453US2025386488A1Integrated circuit memory devices having high degrees of vertical integration and improved electrical characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1552US2024074155A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1651US2024128230A1Soldering device including pulsed light irradiator, soldering method using pulsed light irradiation, and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1748US2014327155A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1842US2015318270A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 1941US2023105710A1Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2040US2025239563A1Apparatus for soldering electronic devicesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2137US2015115846A1Piezoelectric cooling control apparatus and methodKOREA ELECTRONICS TELECOMM·Filed 2014·Application pending·0 cites
- 2236US8009436B2Integrated circuit package system with channelSTATS CHIPPAC LTD·Filed 2006·Granted Aug 30, 2011·0 cites·20 claims
- 2336US2020194596A1Thin film transistor comprising two dimensional material, display comprising the same and manufacturing method for the sameKOREA ADVANCED INST SCI & TECH·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →