Inventor · disambiguated record
Tatsuya Karasawa
Also filed as: KARASAWA TATSUYA
5 granted patents·1 pending application·7 citations·filing 2012–2024
67Inventor score
Top patents by PatentIndex Score
6 records- 0161US10381243B2Semiconductor module having supporting portion for fastening portion inside a through hole in a resin caseFUJI ELECTRIC CO LTD·Filed 2017·Granted Aug 13, 2019·1 cites·11 claims
- 0254US2024304525A1Semiconductor module and manufacturing method thereforFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 0347USD724554SSemiconductor moduleFUJI ELECTRIC CO LTD·Filed 2014·Granted Mar 17, 2015·6 cites·1 claims
- 0444US11177236B2Semiconductor device having case to which circuit board is bonded by bonding material and method of manafacturing thereofFUJI ELECTRIC CO LTD·Filed 2019·Granted Nov 16, 2021·0 cites·16 claims
- 0542US8994164B2Semiconductor device and semiconductor device manufacturing methodHIDEAKI TAKAHASHI·Filed 2012·Granted Mar 31, 2015·0 cites·8 claims
- 0635US9832903B2Power semiconductor module deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Nov 28, 2017·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →