Inventor · disambiguated record
Takashi Kariya
Also filed as: KARIYA TAKASHI
104 granted patents·18 pending applications·1,885 citations·filing 1982–2024
99Inventor score
Top patents by PatentIndex Score
122 records- 0199US6534723B1Multilayer printed-circuit board and semiconductor deviceIBIDEN CO LTD·Filed 2000·Granted Mar 18, 2003·316 cites·28 claims
- 0298US8971053B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Mar 3, 2015·62 cites·20 claims
- 0398US7842887B2Multilayer printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Nov 30, 2010·45 cites·36 claims
- 0498US6909054B2Multilayer printed wiring board and method for producing multilayer printed wiring boardIBIDEN CO LTD·Filed 2001·Granted Jun 21, 2005·131 cites·7 claims
- 0597US7462784B2Heat resistant substrate incorporated circuit wiring boardIBIDEN CO LTD·Filed 2006·Granted Dec 9, 2008·50 cites·10 claims
- 0697US6376052B1Multilayer printed wiring board and its production process, resin composition for filling through-holeIBIDEN CO LTD·Filed 2000·Granted Apr 23, 2002·117 cites·55 claims
- 0796US6440542B1Copper-clad laminated board, and circuit board for printed wiring board and method for producing the sameIBIDEN CO LTD·Filed 2000·Granted Aug 27, 2002·92 cites·10 claims
- 0895US8453323B2Printed circuit board manufacturing methodSAKAMOTO HAJIME·Filed 2011·Granted Jun 4, 2013·12 cites·17 claims
- 0995US7812702B2Inductor and electric power supply using itIBIDEN CO LTD·Filed 2009·Granted Oct 12, 2010·21 cites·13 claims
- 1095US7435910B2Multilayer printed circuit boardIBIDEN CO LTD·Filed 2004·Granted Oct 14, 2008·63 cites·18 claims
- 1195US6889433B1Method of manufacturing printed-circuit boardIBIDEN CO LTD·Filed 2000·Granted May 10, 2005·81 cites·8 claims
- 1294US6376049B1Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-holeIBIDEN CO LTD·Filed 1990·Granted Apr 23, 2002·82 cites·86 claims
- 1393US8079142B2Printed circuit board manufacturing methodSAKAMOTO HAJIME·Filed 2008·Granted Dec 20, 2011·15 cites·13 claims
- 1493US7982139B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2006·Granted Jul 19, 2011·21 cites·15 claims
- 1593US7649748B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2006·Granted Jan 19, 2010·22 cites·17 claims
- 1692US8186045B2Multilayer printed circuit board and multilayer printed circuit board manufacturing methodSAKAMOTO HAJIME·Filed 2008·Granted May 29, 2012·14 cites·9 claims
- 1792US7888606B2Multilayer printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Feb 15, 2011·14 cites·18 claims
- 1891US9893016B2Multilayer wiring board having wiring structure for mounting multiple electronic components and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Feb 13, 2018·8 cites·16 claims
- 1991US6609297B1Method of manufacturing multilayer printed wiring boardIBIDEN CO LTD·Filed 1998·Granted Aug 26, 2003·59 cites·8 claims
- 2090US8207811B2Inductor and electric power supply using itMANO YASUHIKO·Filed 2011·Granted Jun 26, 2012·8 cites·18 claims
- 2189US9572256B2Printed wiring board, method for manufacturing printed wiring board, and package-on-packageIBIDEN CO LTD·Filed 2015·Granted Feb 14, 2017·7 cites·16 claims
- 2289US8008583B2Heat resistant substrate incorporated circuit wiring boardIBIDEN CO LTD·Filed 2008·Granted Aug 30, 2011·12 cites·8 claims
- 2388US7994432B2Heat resistant substrate incorporated circuit wiring boardIBIDEN CO LTD·Filed 2009·Granted Aug 9, 2011·11 cites·10 claims
- 2488US7843302B2Inductor and electric power supply using itIBIDEN CO LTD·Filed 2006·Granted Nov 30, 2010·12 cites·28 claims
- 2588US7049528B2Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor moduleIBIDEN CO LTD·Filed 2002·Granted May 23, 2006·44 cites·4 claims
- 2687US7894203B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2004·Granted Feb 22, 2011·53 cites·11 claims
- 2787US7525190B2Printed wiring board with wiring pattern having narrow width portionIBIDEN CO LTD·Filed 2005·Granted Apr 28, 2009·10 cites·9 claims
- 2887US7497694B2Printed board with a pin for mounting a componentIBIDEN CO LTD·Filed 2006·Granted Mar 3, 2009·14 cites·20 claims
- 2986US11412621B2Device-embedded board and method of manufacturing the sameTDK CORP·Filed 2020·Granted Aug 9, 2022·2 cites·8 claims
- 3086US7868728B2Inductor and electric power supply using itIBIDEN CO LTD·Filed 2010·Granted Jan 11, 2011·6 cites·12 claims
- 3186US7856710B2Method of manufacturing printed wiring boardIBIDEN CO LTD·Filed 2007·Granted Dec 28, 2010·12 cites·6 claims
- 3286US4495780ACooling method and apparatus for hermetic type control boxHITACHI LTD·Filed 1982·Granted Jan 29, 1985·71 cites·6 claims
- 3385US8164920B2Printed wiring boardKARIYA TAKASHI·Filed 2006·Granted Apr 24, 2012·12 cites·15 claims
- 3485US7495332B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2006·Granted Feb 24, 2009·12 cites·9 claims
- 3584US8541691B2Heat resistant substrate incorporated circuit wiring boardKARIYA TAKASHI·Filed 2010·Granted Sep 24, 2013·4 cites·30 claims
- 3684US7888803B2Printed circuit boardIBIDEN CO LTD·Filed 2006·Granted Feb 15, 2011·11 cites·12 claims
- 3784US7480150B2Printed wiring board and method of manufacturing the sameIBIDEN CO LTD·Filed 2006·Granted Jan 20, 2009·9 cites·7 claims
- 3884US6407345B1Printed circuit board and method of production thereofIBIDEN CO LTD·Filed 1999·Granted Jun 18, 2002·48 cites·19 claims
- 3983US9706663B2Printed wiring board, method for manufacturing the same and semiconductor deviceIBIDEN CO LTD·Filed 2015·Granted Jul 11, 2017·4 cites·18 claims
- 4083US9265158B2Inductor component and printed wiring board incorporating inductor component and method for manufacturing inductor componentMANO YASUHIKO·Filed 2012·Granted Feb 16, 2016·7 cites·20 claims
- 4183US8253030B2Multilayer printed wiring boardKARIYA TAKASHI·Filed 2010·Granted Aug 28, 2012·4 cites·13 claims
- 4283US6762921B1Multilayer printed-circuit board and method of manufactureIBIDEN CO LTD·Filed 1999·Granted Jul 13, 2004·52 cites·14 claims
- 4382US8507806B2Heat resistant substrate incorporated circuit wiring boardKARIYA TAKASHI·Filed 2009·Granted Aug 13, 2013·6 cites·20 claims
- 4482US7884286B2Multilayer printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Feb 8, 2011·5 cites·19 claims
- 4582US7489521B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2007·Granted Feb 10, 2009·8 cites·11 claims
- 4682US7262975B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2006·Granted Aug 28, 2007·8 cites·16 claims
- 4781US8654538B2Wiring board and method for manufacturing the sameKARIYA TAKASHI·Filed 2011·Granted Feb 18, 2014·5 cites·20 claims
- 4881US8373069B2Electronic component mounting substrate and method for manufacturing electronic component mounting substrateIBIDEN CO LTD·Filed 2009·Granted Feb 12, 2013·10 cites·7 claims
- 4981US7855626B2Inductor and electric power supply using itIBIDEN CO LTD·Filed 2009·Granted Dec 21, 2010·5 cites·11 claims
- 5081US7773388B2Printed wiring board with component mounting pin and electronic device using the sameIBIDEN CO LTD·Filed 2006·Granted Aug 10, 2010·9 cites·20 claims
Showing the top 50 of 122 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →