Inventor · disambiguated record
Takashi Kasuga
Also filed as: KASUGA TAKASHI
30 granted patents·11 pending applications·142 citations·filing 1993–2024
95Inventor score
Top patents by PatentIndex Score
41 records- 0194US7198736B2Conductive silver paste and conductive film formed using the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2005·Granted Apr 3, 2007·36 cites·5 claims
- 0290US10292265B2Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted May 14, 2019·5 cites·5 claims
- 0385US7285438B2Solid-state imaging device and method for manufacturing solid-state imaging deviceSONY CORP·Filed 2006·Granted Oct 23, 2007·7 cites·4 claims
- 0479US10237976B2Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted Mar 19, 2019·3 cites·11 claims
- 0579US5656402AMethod for alignment of manufacturing semiconductor apparatusSONY CORP·Filed 1995·Granted Aug 12, 1997·46 cites·17 claims
- 0678US10143083B2Substrate for printed circuit board and method for producing substrate for printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted Nov 27, 2018·2 cites·7 claims
- 0776US10225931B2Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted Mar 5, 2019·1 cites·10 claims
- 0873US10076028B2Substrate for printed circuit board, printed circuit board, and method for producing printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted Sep 11, 2018·2 cites·9 claims
- 0972US2024284593A1Wiring substrate and method of manufacturing wiring substrateSHINKO ELECTRIC IND CO·Filed 2024·Application pending·0 cites
- 1070US7285808B2Solid-state imaging device and method for manufacturing solid-state imaging deviceSONY CORP·Filed 2002·Granted Oct 23, 2007·7 cites·12 claims
- 1167US2016330850A1Method for producing printed wiring boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Application pending·0 cites
- 1265US5933212ADelineating method employing electron ray beamSONY CORP·Filed 1996·Granted Aug 3, 1999·19 cites·7 claims
- 1364US12418981B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2022·Granted Sep 16, 2025·0 cites·11 claims
- 1464US12342457B2Wiring board and manufacturing method of wiring boardSHINKO ELECTRIC IND CO·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 1564US11997787B2Wiring substrate and method of manufacturing wiring substrateSHINKO ELECTRIC IND CO·Filed 2022·Granted May 28, 2024·0 cites·14 claims
- 1661US12191255B2Interconnect substrate having groove around padSHINKO ELECTRIC IND CO·Filed 2022·Granted Jan 7, 2025·0 cites·9 claims
- 1759US10842027B2Base material for printed circuit board and printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Granted Nov 17, 2020·0 cites·7 claims
- 1859US2014166495A1Substrate for printed wiring board, printed wiring board, and methods for producing sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2014·Application pending·0 cites
- 1958US10307825B2Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powderSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted Jun 4, 2019·0 cites·6 claims
- 2057US8581118B2Seal structure, method of forming seal structure, wire body, and electronic apparatusKASUGA TAKASHI·Filed 2009·Granted Nov 12, 2013·2 cites·10 claims
- 2156US2008054311A1Solid-state imaging device and method for manufacturing solid-state imaging deviceSONY CORP·Filed 2007·Application pending·0 cites
- 2256US2016330847A1Method for producing printed wiring boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Application pending·0 cites
- 2356US2024098889A1Printed circuit board and method of manufacturing printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2023·Application pending·0 cites
- 2455US12431434B2Built-in component board, method of manufacturing the built-in component boardSHINKO ELECTRIC IND CO·Filed 2022·Granted Sep 30, 2025·0 cites·11 claims
- 2555US11013113B2Base material for printed circuit board and printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Granted May 18, 2021·0 cites·8 claims
- 2654US8309853B2Flexible printed wiring boardOKA YOSHIO·Filed 2008·Granted Nov 13, 2012·1 cites·3 claims
- 2753US7510592B2Method of producing metal powderSUMITOMO ELECTRIC INDUSTRIES·Filed 2004·Granted Mar 31, 2009·2 cites·5 claims
- 2851US10889086B2Resin film, substrate for printed wiring board, and printed wiring boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Granted Jan 12, 2021·0 cites·6 claims
- 2951US10244627B2Substrate for printed wiring board and method for producing the same, printed wiring board and method for producing the same, and resin base materialSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted Mar 26, 2019·0 cites·16 claims
- 3050US9967976B2Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted May 8, 2018·0 cites·10 claims
- 3149US11864312B2Printed circuit board and method of manufacturing printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2020·Granted Jan 2, 2024·0 cites·4 claims
- 3249US2012031656A1Substrate for printed wiring board, printed wiring board, and methods for producing sameOKA YOSHIO·Filed 2010·Application pending·0 cites
- 3348US2014332258A1Double-sided printed wiring board and method for producing the sameSUMITOMO ELEC PRINTED CIRCUITS·Filed 2013·Application pending·0 cites
- 3447US10537020B2Printed circuit board and electronic componentSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted Jan 14, 2020·0 cites·7 claims
- 3545US10596782B2Substrate for printed circuit board and printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted Mar 24, 2020·0 cites·14 claims
- 3644US10076032B2Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted Sep 11, 2018·0 cites·9 claims
- 3743US10537017B2Printed circuit board and electronic componentSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted Jan 14, 2020·0 cites·5 claims
- 3842US2018333739A1Coating device and method of producing coated sheetSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Application pending·0 cites
- 3941US2021127487A1Base material for printed circuit board and printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2019·Application pending·0 cites
- 4041US2018371191A1Base film for printed circuit board, substrate for printed circuit board, and method for manufacturing substrate for printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Application pending·0 cites
- 4138US5976766AContact hole forming methodSONY CORP·Filed 1993·Granted Nov 2, 1999·9 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →