Inventor · disambiguated record
Tatsuo Kataoka
Also filed as: KATAOKA TATSUO
14 granted patents·12 pending applications·389 citations·filing 1989–2010
93Inventor score
Files withMITSUI MINING & SMELTING CO17MITSUBISHI ELECTRIC CORP3KATAOKA TATSUO1SHIMADA RIKA KOGYO KK1SHIMADA RIKA KOUGYO KABUSHIKI1
Top patents by PatentIndex Score
26 records- 0196US5019944AMounting substrate and its production method, and printed wiring board having connector function and its connection methodMITSUI MINING & SMELTING CO·Filed 1989·Granted May 28, 1991·139 cites·15 claims
- 0289US6616773B1Substrate treatment methodMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 9, 2003·47 cites·12 claims
- 0383US5118386APrinted circuit board having bumps and method of forming bumpsMITSUI MINING & SMELTING CO·Filed 1989·Granted Jun 2, 1992·66 cites·7 claims
- 0473US7523548B2Method for producing a printed circuit boardMITSUI MINING & SMELTING CO·Filed 2004·Granted Apr 28, 2009·19 cites·3 claims
- 0573US6715944B2Apparatus for removing photoresist filmMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Apr 6, 2004·16 cites·6 claims
- 0672US6517999B1Method of removing photoresist filmSHIMADA RIKA KOUGYO KABUSHIKI·Filed 2000·Granted Feb 11, 2003·20 cites·9 claims
- 0765US7495177B2Printed wiring board, its manufacturing method, and circuit deviceMITSUI MINING & SMELTING CO·Filed 2004·Granted Feb 24, 2009·12 cites·1 claims
- 0861US7060364B2Film carrier tape for mounting electronic devices thereonMITSUI MINING & SMELTING CO·Filed 2003·Granted Jun 13, 2006·10 cites·8 claims
- 0960US6955178B1Substrate treatment apparatusMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Oct 18, 2005·6 cites·8 claims
- 1060US5173369ATape carrier having connection functionMITSUI MINING & SMELTING CO·Filed 1990·Granted Dec 22, 1992·31 cites·9 claims
- 1149US6129100AWafer cleaning apparatus and structure for holding and transferring wafer used in wafer cleaning apparatusSPC ELECTRONICS·Filed 1998·Granted Oct 10, 2000·20 cites·21 claims
- 1248US2009317591A1Metal Composite Laminate for Producing Flexible Wiring Board and Flexible Wiring BoardMITSUI MINING & SMELTING CO·Filed 2007·Application pending·0 cites
- 1348US2007145584A1Printed wiring board, method for manufacturing same, and circuit deviceMITSUI MINING & SMELTING CO·Filed 2004·Application pending·0 cites
- 1443US2009314525A1Mold for Wiring Substrate Formation and Process for Producing the Same, Wiring Substrate and Process for Producing the Same, Process for Producing Multilayered Laminated Wiring Substrate and Method for Viahole FormationMITSUI MINING & SMELTING CO·Filed 2006·Application pending·0 cites
- 1543US2009044971A1Printed Wiring Board, Process for Producing the Same and Usage of the SameMITSUI MINING & SMELTING CO·Filed 2006·Application pending·0 cites
- 1642US2008236872A1Printed Wiring Board, Process For Producing the Same and Semiconductor DeviceMITSUI MINING & SMELTING CO·Filed 2005·Application pending·0 cites
- 1742US2010244281A1Flexible printed wiring board and semiconductor device employing the sameMITSUI MINING & SMELTING CO·Filed 2010·Application pending·0 cites
- 1841US2009183901A1Wiring Boards and Processes for Manufacturing the SameMITSUI MINING & SMELTING CO·Filed 2007·Application pending·0 cites
- 1938US2007006904A1Substrate cleaning system and substrate cleaning methodSHIMADA RIKA KOGYO KK·Filed 2006·Application pending·0 cites
- 2037US2006027912A1Film carrier tape for mounting of electronic partKATAOKA TATSUO·Filed 2003·Application pending·0 cites
- 2135US6798048B22-Metal layer TAB tape and both-sided CSP•BGA tapeMITSUI MINING & SMELTING CO·Filed 2001·Granted Sep 28, 2004·0 cites·14 claims
- 2235US2004202958A1Plating-pretreatment solution and plating-pretreatment methodMITSUI MINING & SMELTING CO·Filed 2004·Application pending·0 cites
- 2332US2003226687A1Method of manufacturing printed wiring board and printed wiring board obtained by the manufacturing methodFiled 2003·Application pending·0 cites
- 2432US2004026122A1Printed circuit board and production method therefor, and laminated printed circuit boardFiled 2002·Application pending·0 cites
- 2527US5866020AMethod of manufacturing TAB tapes and laminated body for producing the sameMITSUI MINING & SMELTING CO·Filed 1996·Granted Feb 2, 1999·2 cites·8 claims
- 2626US5919538AMethod of manufacturing TAB tapes and laminated body for producing the sameMITSUI MINING & SMELTING CO·Filed 1998·Granted Jul 6, 1999·1 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →