Inventor · disambiguated record
Takahiko Kawasaki
Also filed as: KAWASAKI TAKAHIKO
16 granted patents·7 pending applications·29 citations·filing 2000–2021
89Inventor score
Top patents by PatentIndex Score
23 records- 0190US9455373B2Light emitting element, method of manufacturing the same, and light emitting deviceSONY CORP·Filed 2012·Granted Sep 27, 2016·8 cites·17 claims
- 0286US10850363B2Manufacturing method of semiconductor device and semiconductor manufacturing apparatusTOSHIBA MEMORY CORP·Filed 2015·Granted Dec 1, 2020·3 cites·7 claims
- 0384US9837279B2Manufacturing method of semiconductor device and semiconductor device manufacturing apparatusTOSHIBA MEMORY CORP·Filed 2016·Granted Dec 5, 2017·3 cites·10 claims
- 0478US7927187B2Method of polishing a target surfaceNIPPON MICRO COATING KK·Filed 2008·Granted Apr 19, 2011·7 cites·8 claims
- 0573US8987763B2Light emitting device and method of manufacturing the same, and light emitting unitSONY CORP·Filed 2013·Granted Mar 24, 2015·2 cites·14 claims
- 0670US10195716B2Dresser, method of manufacturing dresser, and method of manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2017·Granted Feb 5, 2019·1 cites·18 claims
- 0767US11883926B2Polishing pad, semiconductor fabricating device and fabricating method of semiconductor deviceKIOXIA CORP·Filed 2021·Granted Jan 30, 2024·0 cites·16 claims
- 0864US10121677B2Manufacturing method of semiconductor deviceTOSHIBA MEMORY CORP·Filed 2016·Granted Nov 6, 2018·1 cites·10 claims
- 0956US10991588B2Manufacturing method of semiconductor device and semiconductor device manufacturing apparatusTOSHIBA MEMORY CORP·Filed 2017·Granted Apr 27, 2021·0 cites·26 claims
- 1056US10010997B2Abrasive cloth and polishing methodTOSHIBA MEMORY CORP·Filed 2015·Granted Jul 3, 2018·0 cites·16 claims
- 1155US2021039224A1Polishing apparatus and retainer ringKIOXIA CORP·Filed 2020·Application pending·0 cites
- 1253US2019283206A1Polishing pad, semiconductor fabricating device and fabricating method of semiconductor deviceTOSHIBA MEMORY CORP·Filed 2018·Application pending·0 cites
- 1352US2018277388A1Manufacturing method of semiconductor device and semiconductor manufacturing apparatusTOSHIBA MEMORY CORP·Filed 2018·Application pending·0 cites
- 1451US2021069861A1Grinding apparatus and grinding methodKIOXIA CORP·Filed 2020·Application pending·0 cites
- 1549US10008390B2Manufacturing method of semiconductor device and semiconductor manufacturing apparatusTOSHIBA MEMORY CORP·Filed 2015·Granted Jun 26, 2018·0 cites·12 claims
- 1649US6817694B1Ink jet system image forming deviceCANON FINETECH INC·Filed 2000·Granted Nov 16, 2004·4 cites·15 claims
- 1746US10079153B2Semiconductor storage deviceTOSHIBA MEMORY CORP·Filed 2017·Granted Sep 18, 2018·0 cites·17 claims
- 1845US10998283B2Semiconductor device production methodTOSHIBA MEMORY CORP·Filed 2019·Granted May 4, 2021·0 cites·10 claims
- 1942US9558961B2Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2016·Granted Jan 31, 2017·0 cites·12 claims
- 2041US2016229026A1Retainer ring, polishing apparatus, and manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2015·Application pending·0 cites
- 2138US10811562B2Light emitting diodeSONY CORP·Filed 2015·Granted Oct 20, 2020·0 cites·9 claims
- 2235US2017133238A1Manufacturing method of semiconductor device and slurry for chemical mechanical polishingTOSHIBA KK·Filed 2016·Application pending·0 cites
- 2333US2017162747A1Light-emitting element and light-emitting element assemblySONY CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →