Inventor · disambiguated record
Takamaro Kikkawa
Also filed as: KIKKAWA TAKAMARO
5 granted patents·1 pending application·95 citations·filing 1987–2011
80Inventor score
Top patents by PatentIndex Score
6 records- 0174US5345108ASemiconductor device having multi-layer electrode wiringNEC CORP·Filed 1992·Granted Sep 6, 1994·56 cites·4 claims
- 0269US8030221B2Method for producing low-k l film, semiconductor device, and method for manufacturing the sameELPIDA MEMORY INC·Filed 2009·Granted Oct 4, 2011·3 cites·19 claims
- 0357US4933305AProcess of wire bonding for semiconductor deviceNEC CORP·Filed 1988·Granted Jun 12, 1990·26 cites·15 claims
- 0440US8253251B2Method for producing low-k film, semiconductor device, and method for manufacturing the sameCHO YOSHINORI·Filed 2011·Granted Aug 28, 2012·0 cites·17 claims
- 0537US4816895AIntegrated circuit device with an improved interconnection lineNEC CORP·Filed 1987·Granted Mar 28, 1989·10 cites·4 claims
- 0636US2008106469A1Semiconductor DeviceJAPAN SCIENCE & TECH AGENCY·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →