Inventor · disambiguated record
Tae Hyeok Kim
Also filed as: KIM TAE HYEOK
15 granted patents·3 pending applications·20 citations·filing 2012–2022
86Inventor score
Top patents by PatentIndex Score
18 records- 0193US9048026B2Multilayered ceramic capacitor, mounting structure of circuit board having multilayered ceramic capacitor mounted thereon, and packing unit for multilayered ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2013·Granted Jun 2, 2015·12 cites·23 claims
- 0279US9627139B2Multilayered ceramic capacitor and board for mounting the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 18, 2017·3 cites·10 claims
- 0378US9343229B2Multilayer ceramic capacitor and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2014·Granted May 17, 2016·3 cites·14 claims
- 0471US9263185B2Multilayer ceramic capacitor and circuit board for mounting the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Feb 16, 2016·2 cites·10 claims
- 0566US11101075B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Aug 24, 2021·0 cites·20 claims
- 0664US10748712B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 18, 2020·0 cites·16 claims
- 0758US12271189B2System and method for vehicle remote control systemHYUNDAI MOBIS CO LTD·Filed 2022·Granted Apr 8, 2025·0 cites·12 claims
- 0849US9208950B2Multilayer ceramic capacitor and board for mounting the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 8, 2015·0 cites·12 claims
- 0949US2015041197A1Embedded multilayer ceramic electronic component and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1049US2015049412A1Multilayer ceramic capacitor, method of manufacturing the same, and pressing plate for multilayer ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1148US9299497B2Multilayer ceramic capacitor and board for mounting the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Mar 29, 2016·0 cites·16 claims
- 1248US9099249B2Multilayered ceramic capacitor, mounting structure of circuit board having multilayered ceramic capacitor thereon, and packing unit for multilayered ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 4, 2015·0 cites·12 claims
- 1347US10892100B2Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2018·Granted Jan 12, 2021·0 cites·21 claims
- 1445US11127531B2Multilayer ceramic electronic component having dummy electrodes in cover layer of body thereofSAMSUNG ELECTRO MECH·Filed 2019·Granted Sep 21, 2021·0 cites·18 claims
- 1544US10354800B2Multilayer ceramic electronic component, method of manufacturing the same, and print circuit board having the same embedded thereinSAMSUNG ELECTRO MECH·Filed 2018·Granted Jul 16, 2019·0 cites·20 claims
- 1643US11133131B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Sep 28, 2021·0 cites·24 claims
- 1743US9847172B2Embedded device, and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Dec 19, 2017·0 cites·15 claims
- 1840US2013241361A1Multilayer ceramic electronic component and fabrication method thereofLEE CHUNG EUN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →