Inventor · disambiguated record
Tae-Yeong Kim
Also filed as: KIM TAE YEONG
21 granted patents·4 pending applications·345 citations·filing 2013–2023
94Inventor score
Files withSAMSUNG ELECTRONICS CO LTD20NEUROPHET INC2LG ELECTRONICS INC1POSTECH RES & BUSINESS DEV FOUND1RESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV1
Top patents by PatentIndex Score
25 records- 0198US9941243B2Wafer-to-wafer bonding structureSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 10, 2018·237 cites·20 claims
- 0296US9865581B2Method of fabricating multi-substrate semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 9, 2018·25 cites·20 claims
- 0396US9520361B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 13, 2016·28 cites·20 claims
- 0495US12051601B2Method of bonding substrates utilizing a substrate holder with holding fingersSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 30, 2024·2 cites·20 claims
- 0594US9935037B2Multi-stacked device having TSV structureSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 3, 2018·13 cites·20 claims
- 0693US10639875B2Wafer bonding apparatus and wafer bonding system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 5, 2020·6 cites·20 claims
- 0792US10468400B2Method of manufacturing substrate structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 5, 2019·8 cites·19 claims
- 0888US10906283B2Wafer bonding apparatus for directly bonding wafers and a wafer bonding system having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 2, 2021·5 cites·19 claims
- 0984US10833047B2Apparatuses of bonding substrates and methods of bonding substratesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 10, 2020·5 cites·15 claims
- 1083US9236349B2Semiconductor device including through via structures and redistribution structuresSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 12, 2016·6 cites·20 claims
- 1179US11640912B2Apparatus for bonding substrates having a substrate holder with holding fingers and method of bonding substratesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 2, 2023·2 cites·19 claims
- 1277US9773660B2Wafer processing methodsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 26, 2017·3 cites·20 claims
- 1377US9287251B2Method of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 15, 2016·3 cites·20 claims
- 1470US10763243B2Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 1, 2020·1 cites·18 claims
- 1569US10999848B2Sparse-coded ambient backscatter communication method and systemRESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV·Filed 2018·Granted May 4, 2021·1 cites·18 claims
- 1668US2024071589A1System and method for redesigning treatment prescriptions according to evaluation of treatment effectivenessNEUROPHET INC·Filed 2023·Application pending·0 cites
- 1761US11283235B2Semiconductor laser deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 22, 2022·0 cites·20 claims
- 1857US2024213138A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1952US10971379B2Wafer bonding apparatus and wafer bonding system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 6, 2021·0 cites·20 claims
- 2046US11728200B2Wafer bonding apparatusesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 15, 2023·0 cites·20 claims
- 2146US10523302B2Apparatus and method for selecting beam pattern in communication system supporting beamforming schemeSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 31, 2019·0 cites·20 claims
- 2244US12458801B2Electric stimulation simulation method, server, and computer program for determining optimal stimulation position combinationNEUROPHET INC·Filed 2022·Granted Nov 4, 2025·0 cites·8 claims
- 2344US10200889B2Method for receiving signal using distribution storage cache retention auxiliary node in wireless communication system, and apparatus thereforLG ELECTRONICS INC·Filed 2016·Granted Feb 5, 2019·0 cites·10 claims
- 2444US2014199810A1Methods for Forming Semiconductor Devices Using Sacrificial LayersSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2542US2022136919A1Spike spectrum output-type pressure sensor comprising electrolyte, and method for manufacturing samePOSTECH RES & BUSINESS DEV FOUND·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →