Inventor · disambiguated record
Tae Yeop Kim
Also filed as: KIM TAE YEOP · KIM TAE YEOP JAMES
9 granted patents·2 pending applications·5 citations·filing 2013–2022
77Inventor score
Files withHYUNDAI AUTRON CO LTD3HERAEUS MATERIALS SINGAPORE PTE LTD2HYUNDAI MOBIS CO LTD2HAN ALL TECHNOLOGY INC1HERAEUS DEUTSCHLAND GMBH & CO KG1
Top patents by PatentIndex Score
11 records- 0173US10894498B2ContainerLG CHEMICAL LTD·Filed 2017·Granted Jan 19, 2021·3 cites·16 claims
- 0266US10960498B2Coated wireHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2016·Granted Mar 30, 2021·2 cites·16 claims
- 0363US12484271B2Power semiconductor device and method for fabricating the sameHYUNDAI MOBIS CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·17 claims
- 0452US2023012361A1Power semiconductor deviceHYUNDAI MOBIS CO LTD·Filed 2022·Application pending·0 cites
- 0546US10181519B2Power semiconductor deviceHYUNDAI AUTRON CO LTD·Filed 2017·Granted Jan 15, 2019·0 cites·15 claims
- 0642US9905681B2Power semiconductor device and method of fabricating the sameHYUNDAI AUTRON CO LTD·Filed 2017·Granted Feb 27, 2018·0 cites·16 claims
- 0738US10121850B2Power semiconductor device and method of fabricating the sameHYUNDAI AUTRON CO LTD·Filed 2017·Granted Nov 6, 2018·0 cites·9 claims
- 0830US11791309B2Process for electrically connecting contact surfaces of electronic componentsHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2018·Granted Oct 17, 2023·0 cites·19 claims
- 0927US9348667B2Apparatus for managing application program and method thereforHAN ALL TECHNOLOGY INC·Filed 2013·Granted May 24, 2016·0 cites·4 claims
- 1024US2017256517A1Silver bonding wire and method of manufacturing the sameHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2015·Application pending·0 cites
- 1122USD1066494SBody for writing instrumentZERO G TECH CO LTD·Filed 2021·Granted Mar 11, 2025·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →