Inventor · disambiguated record
Takuo Kisaki
Also filed as: KISAKI TAKUO
8 granted patents·1 pending application·4 citations·filing 2016–2022
76Inventor score
Technology areasH10W
Files withKYOCERA CORP9
Top patents by PatentIndex Score
9 records- 0177US10832980B2Electronic component housing package, multi-piece wiring substrate, electronic apparatus, and electronic moduleKYOCERA CORP·Filed 2019·Granted Nov 10, 2020·2 cites·12 claims
- 0275US10355665B2Electronic component housing package, electronic apparatus, and electronic moduleKYOCERA CORP·Filed 2016·Granted Jul 16, 2019·2 cites·12 claims
- 0371US11923288B2Wiring substrate, electronic device, and electronic module each having plate-shaped conductive portion in frame portion of insulation substrateKYOCERA CORP·Filed 2022·Granted Mar 5, 2024·0 cites·10 claims
- 0458US11394362B2Electronic component housing package, electronic apparatus, and electronic moduleKYOCERA CORP·Filed 2019·Granted Jul 19, 2022·0 cites·14 claims
- 0555US11515242B2Wiring substrate, electronic device, and electronic module each having plate-shaped conductive portion in frame portion of insulation substrateKYOCERA CORP·Filed 2018·Granted Nov 29, 2022·0 cites·15 claims
- 0649US11116077B2Wiring board, electronic device, and electronic moduleKYOCERA CORP·Filed 2019·Granted Sep 7, 2021·0 cites·20 claims
- 0747US10381281B2Electronic component housing package, multi-piece wiring substrate, electronic apparatus, and electronic module having curved connection conductorsKYOCERA CORP·Filed 2017·Granted Aug 13, 2019·0 cites·12 claims
- 0847US2024145318A1Package for accommodating electronic component, electronic apparatus, and electronic moduleKYOCERA CORP·Filed 2022·Application pending·0 cites
- 0943US11388819B2Wiring board, electronic device, and electronic moduleKYOCERA CORP·Filed 2019·Granted Jul 12, 2022·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →