Inventor · disambiguated record
Takeshi Kita
Also filed as: KITA TAKESHI
9 granted patents·1 pending application·41 citations·filing 1975–2016
83Inventor score
Files withPANASONIC IP MAN CO LTD4SEIKISUI CHEMICAL CO LTD3KAI TAKAYUKI1PANASONIC CORP1UBE INDUSTRIES1
Top patents by PatentIndex Score
10 records- 0169US7994634B2Semiconductor element and semiconductor element fabrication methodPANASONIC CORP·Filed 2009·Granted Aug 9, 2011·4 cites·14 claims
- 0263US7846546B2Electrically conducting-inorganic substance-containing silicon carbide-based fine particles, electromagnetic wave absorbing material and electromagnetic wave absorberUBE INDUSTRIES·Filed 2006·Granted Dec 7, 2010·3 cites·15 claims
- 0354US4110394AProcess for extrusion forming of resin formed body having different thicknessSEIKISUI CHEMICAL CO LTD·Filed 1976·Granted Aug 29, 1978·16 cites·5 claims
- 0453US9855747B2Inkjet head and inkjet devicePANASONIC IP MAN CO LTD·Filed 2015·Granted Jan 2, 2018·0 cites·13 claims
- 0552US4036930AMethod of manufacturing resin tubes alternately having a thick wall portion and a thin wall portionSEIKISUI CHEMICAL CO LTD·Filed 1975·Granted Jul 19, 1977·15 cites·14 claims
- 0646US10112389B2Inkjet head and coating apparatus using samePANASONIC IP MAN CO LTD·Filed 2015·Granted Oct 30, 2018·0 cites·13 claims
- 0745US9773963B2Method for connecting piezoelectric element and cable substrate, piezoelectric element having cable substrate, and inkjet head including piezoelectric element with cable substratePANASONIC IP MAN CO LTD·Filed 2016·Granted Sep 26, 2017·0 cites·11 claims
- 0845US9293683B2Method for connecting piezoelectric element and cable substrate, piezoelectric element having cable substrate, and inkjet head including piezoelectric element with cable substratePANASONIC IP MAN CO LTD·Filed 2015·Granted Mar 22, 2016·0 cites·5 claims
- 0943US2011057326A1Method for forming through electrode and semiconductor deviceKAI TAKAYUKI·Filed 2009·Application pending·0 cites
- 1029US4135871AApparatus for manufacturing resin tubes alternately having a thick wall portion and a thin wall portionSEIKISUI CHEMICAL CO LTD·Filed 1977·Granted Jan 23, 1979·3 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →