Inventor · disambiguated record
Takayo Kitajima
Also filed as: KITAJIMA TAKAYO
1 granted patent·4 pending applications·0 citations·filing 2017–2023
13Inventor score
Top patents by PatentIndex Score
5 records- 0168US2025326893A1Resin composition, prepreg, laminate, resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 0262US11691389B2Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin compositionSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Jul 4, 2023·0 cites·13 claims
- 0357US2024247120A1Prepreg, laminated plate, metal-clad laminated plate, printed wiring board, semiconductor package, method for manufacturing prepreg, and method for manufacturing metal-clad laminated plateRESONAC CORP·Filed 2022·Application pending·0 cites
- 0454US2019161586A1Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin compositionHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 0548US2025234458A1Metal-clad laminate, printed wiring board, semiconductor package, and method for manufacturing sameRESONAC CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →