Inventor · disambiguated record
Tark-Hyun Ko
Also filed as: KO Tark-Hyun
2 granted patents·2 citations·filing 2017–2019
43Inventor score
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0168US10607905B2Package substrate for a semiconductor package having landing pads extending toward a through-hole in a chip mounting regionSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 31, 2020·1 cites·20 claims
- 0264US10361135B2Semiconductor package including landing pads extending at an oblique angle toward a through-hole in the package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 23, 2019·1 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →