Inventor · disambiguated record
Takeshi Komiyama
Also filed as: KOMIYAMA Takeshi
11 granted patents·1 pending application·190 citations·filing 1990–2017
90Inventor score
Top patents by PatentIndex Score
12 records- 0190US9645318B2Optical connector and method for manufacturing optical connectorFUJITSU COMPONENT LTD·Filed 2015·Granted May 9, 2017·8 cites·6 claims
- 0290US6109507AMethod of forming solder bumps and method of forming preformed solder bumpsFUJITSU LTD·Filed 1998·Granted Aug 29, 2000·88 cites·8 claims
- 0385US6885522B1Head assembly having integrated circuit chip covered by layer which prevents foreign particle generationFUJITSU LTD·Filed 2000·Granted Apr 26, 2005·17 cites·12 claims
- 0484US7347347B2Head assembly, disk unit, and bonding method and apparatusFUJITSU LTD·Filed 2004·Granted Mar 25, 2008·15 cites·11 claims
- 0579US9423572B2Optical connector and method for manufacturing optical connectorFUJITSU COMPONENT LTD·Filed 2015·Granted Aug 23, 2016·3 cites·10 claims
- 0672US5956317AComposite optical disk with structure for preventing adhesive from leaking into the center holeTOSHIBA EMI KK·Filed 1996·Granted Sep 21, 1999·34 cites·5 claims
- 0755US5374391AMolded ceramic articles and production method thereofHONDA MOTOR CO LTD·Filed 1993·Granted Dec 20, 1994·10 cites·10 claims
- 0849US9933579B2Optical module and method of manufacturing optical moduleFUJITSU COMPONENT LTD·Filed 2017·Granted Apr 3, 2018·0 cites·7 claims
- 0945US5443615AMolded ceramic articlesHONDA MOTOR CO LTD·Filed 1992·Granted Aug 22, 1995·8 cites·6 claims
- 1040US5590388AMolded ceramic articles and production method thereofHONDA MOTOR CO LTD·Filed 1994·Granted Dec 31, 1996·5 cites·10 claims
- 1135US2017068056A1Device mounting apparatus and device mounting methodFUJITSU COMPONENT LTD·Filed 2016·Application pending·0 cites
- 1229US5034855APrinted circuit assemblyFUJITSU LTD·Filed 1990·Granted Jul 23, 1991·2 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →