Inventor · disambiguated record
Takashi Koshiro
Also filed as: KOSHIRO TAKASHI
10 granted patents·2 pending applications·3 citations·filing 2010–2022
78Inventor score
Top patents by PatentIndex Score
12 records- 0175US10864596B2Metal laminate material and production method thereforTOYO KOHAN CO LTD·Filed 2016·Granted Dec 15, 2020·1 cites·7 claims
- 0274US11691386B2Roll-bonded laminate and method for producing the sameTOYO KOHAN CO LTD·Filed 2022·Granted Jul 4, 2023·0 cites·6 claims
- 0372US8815777B2Metal laminated substrate for use as an oxide superconducting wire material, and manufacturing method thereforOKAYAMA HIRONAO·Filed 2010·Granted Aug 26, 2014·2 cites·3 claims
- 0469US11305512B2Roll-bonded laminate and method for producing the sameTOYO KOHAN CO LTD·Filed 2018·Granted Apr 19, 2022·0 cites·9 claims
- 0563US10174420B2Method for forming oxide layer, laminated substrate for epitaxial growth, and method for producing the sameTOYO KOHAN CO LTD·Filed 2014·Granted Jan 8, 2019·0 cites·12 claims
- 0660US11590603B2Roll-bonded body and method for producing sameTOYO KOHAN CO LTD·Filed 2018·Granted Feb 28, 2023·0 cites·13 claims
- 0760US10087552B2Substrate for epitaxial growth, manufacturing method therefor, and substrate for superconducting wireTOYO KOHAN CO LTD·Filed 2013·Granted Oct 2, 2018·0 cites·6 claims
- 0858US10115501B2Substrate for superconducting wire, method for manufacturing the same, and superconducting wireTOYO KOHAN CO LTD·Filed 2014·Granted Oct 30, 2018·0 cites·5 claims
- 0956US11840045B2Roll-bonded laminateTOYO KOHAN CO LTD·Filed 2018·Granted Dec 12, 2023·0 cites·3 claims
- 1049US10259073B2Method for producing metal laminate materialTOYO KOHAN CO LTD·Filed 2015·Granted Apr 16, 2019·0 cites·8 claims
- 1144US2021114347A1Roll-bonded laminate for electronic device and electronic device housingTOYO KOHAN CO LTD·Filed 2018·Application pending·0 cites
- 1238US2017014942A1Method for producing metal laminate materialTOYO KOHAN CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →