Inventor · disambiguated record
Takahiko Kudoh
Also filed as: KUDOH TAKAHIKO
4 granted patents·4 pending applications·5 citations·filing 2005–2018
64Inventor score
Top patents by PatentIndex Score
8 records- 0173US10128219B2Multi-chip module including stacked power devices with metal clipTEXAS INSTRUMENTS INC·Filed 2013·Granted Nov 13, 2018·3 cites·13 claims
- 0255US8114706B2Selective removal of gold from a lead frameKUDOH TAKAHIKO·Filed 2011·Granted Feb 14, 2012·2 cites·20 claims
- 0354US11495580B2Multi-chip module including stacked power devices with metal clipTEXAS INSTRUMENTS INC·Filed 2018·Granted Nov 8, 2022·0 cites·20 claims
- 0440US7956445B2Packaged integrated circuit having gold removed from a lead frameTEXAS INSTRUMENTS INC·Filed 2006·Granted Jun 7, 2011·0 cites·15 claims
- 0533US2012205354A1Reducing dross welding phenomenon during irradiation engraving of a metal sheetKUDOH TAKAHIKO·Filed 2011·Application pending·0 cites
- 0633US2008290481A1Semiconductor Device Package LeadframeKUDOH TAKAHIKO·Filed 2007·Application pending·0 cites
- 0732US2006170081A1Method and apparatus for packaging an electronic chipGERBER MARK A·Filed 2005·Application pending·0 cites
- 0830US2008157297A1Stress-Resistant Leadframe and MethodKUDOH TAKAHIKO·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →