Inventor · disambiguated record
Takeshi Kujiraoka
Also filed as: KUJIRAOKA TAKESHI
4 granted patents·64 citations·filing 1989–1995
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0152US5364706AClad bonding wire for semiconductor deviceTANAKA ELECTRONICS IND·Filed 1991·Granted Nov 15, 1994·24 cites·10 claims
- 0249US4938923AGold wire for the bonding of a semiconductor deviceKUJIRAOKA TAKESHI·Filed 1989·Granted Jul 3, 1990·19 cites·6 claims
- 0345US5538685APalladium bonding wire for semiconductor deviceTANAKA ELECTRONICS IND·Filed 1995·Granted Jul 23, 1996·13 cites·13 claims
- 0435US5298219AHigh purity gold bonding wire for semiconductor deviceTANAKA ELECTRONICS IND·Filed 1991·Granted Mar 29, 1994·8 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →