Inventor · disambiguated record
Takahiro Kumakawa
Also filed as: KUMAKAWA TAKAHIRO
18 granted patents·12 pending applications·636 citations·filing 1998–2025
95Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD9PANASONIC IP MAN CO LTD9PANASONIC CORP8KUMAKAWA TAKAHIRO1TAKEMURA KOJI1
Top patents by PatentIndex Score
30 records- 0198US7859084B2Semiconductor substratePANASONIC CORP·Filed 2009·Granted Dec 28, 2010·124 cites·3 claims
- 0297US7838323B2Method for fabricating semiconductor devicePANASONIC CORP·Filed 2009·Granted Nov 23, 2010·114 cites·8 claims
- 0396US7754584B2Semiconductor substrate, and semiconductor device and method of manufacturing the semiconductor devicePANASONIC CORP·Filed 2009·Granted Jul 13, 2010·113 cites·11 claims
- 0491US6852616B2Semiconductor device and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 8, 2005·72 cites·10 claims
- 0590US6559528B2Semiconductor device and method for the fabrication thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 6, 2003·59 cites·6 claims
- 0689US11227725B2Solid electrolytic capacitor including a plurality of capacitor elements and method for producing the samePANASONIC IP MAN CO LTD·Filed 2019·Granted Jan 18, 2022·5 cites·10 claims
- 0788US6313532B1Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Nov 6, 2001·74 cites·8 claims
- 0885US6512298B2Semiconductor device and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 28, 2003·40 cites·14 claims
- 0983US11295902B2Solid electrolytic capacitor including anode body penetrating into anode-side electrode layerPANASONIC IP MAN CO LTD·Filed 2020·Granted Apr 5, 2022·2 cites·10 claims
- 1077US8299580B2Semiconductor wafer and a method of separating the sameKUMAKAWA TAKAHIRO·Filed 2010·Granted Oct 30, 2012·5 cites·11 claims
- 1177US6812573B2Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Nov 2, 2004·18 cites·15 claims
- 1275US7964475B2Semiconductor wafer, method of manufacturing the same and semiconductor devicePANASONIC CORP·Filed 2007·Granted Jun 21, 2011·6 cites·20 claims
- 1367US2025389907A1Method for producing optical module, and optical modulePANASONIC IP MAN CO LTD·Filed 2025·Application pending·0 cites
- 1467US2019172810A1Joined structure, joining method, and joining materialPANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 1566US11742150B2Solid electrolytic capacitor including an exterior body that covers a capacitor element and method of manufacturing the samePANASONIC IP MAN CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·7 claims
- 1666US11715606B2Solid electrolytic capacitor having a metal film formed on a portion of a cathode body exposed from an exterior bodyPANASONIC IP MAN CO LTD·Filed 2021·Granted Aug 1, 2023·0 cites·7 claims
- 1763US2024387444A1Flip-chip mounting structure and flip-chip mounting methodPANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 1861US12257650B2Joined structure, joining method, and joining materialPANASONIC IP MAN CO LTD·Filed 2020·Granted Mar 25, 2025·0 cites·5 claims
- 1956US2007287215A1Method for fabricating semiconductor deviceUTSUMI MASAKI·Filed 2007·Application pending·0 cites
- 2053US7808059B2Semiconductor substrate, and semiconductor device and method of manufacturing the semiconductor devicePANASONIC CORP·Filed 2007·Granted Oct 5, 2010·0 cites·10 claims
- 2152US2008203538A1Semiconductor wafer with division guide patternMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 2252US2009108410A1Semiconductor deviceTAKEMURA KOJI·Filed 2008·Application pending·0 cites
- 2351US6924173B2Semiconductor device and method for the fabrication thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Aug 2, 2005·4 cites·7 claims
- 2451US2011039365A1Method for fabricating semiconductor devicePANASONIC CORP·Filed 2010·Application pending·0 cites
- 2550US2011108957A1Semiconductor substrate, semiconductor device and method of manufacturing the samePANASONIC CORP·Filed 2010·Application pending·0 cites
- 2647US2006163699A1Semiconductor wafer, semiconductor device manufacturing method, and semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 2746US12293877B2Electrolytic capacitorPANASONIC IP MAN CO LTD·Filed 2020·Granted May 6, 2025·0 cites·14 claims
- 2846US2011024882A1Semiconductor devicePANASONIC CORP·Filed 2010·Application pending·0 cites
- 2942US2005006749A1Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 3039US2002000655A1Semiconductor device and method for manufacturing the sameFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →