Inventor · disambiguated record
Takashi Kumamoto
Also filed as: KUMAMOTO TAKASHI
14 granted patents·3 pending applications·344 citations·filing 2000–2021
94Inventor score
Top patents by PatentIndex Score
17 records- 0193USD1036336SInstrument panel for an automobileHONDA MOTOR CO LTD·Filed 2021·Granted Jul 23, 2024·19 cites·1 claims
- 0291US7138709B2Microelectronic package arrayINTEL CORP·Filed 2003·Granted Nov 21, 2006·67 cites·23 claims
- 0390US7145226B2Scalable microelectronic package using conductive risersINTEL CORP·Filed 2003·Granted Dec 5, 2006·64 cites·16 claims
- 0488US6794751B2Multi-purpose planarizing/back-grind/pre-underfill arrangements for bumped wafers and diesINTEL CORP·Filed 2001·Granted Sep 21, 2004·50 cites·25 claims
- 0586US6632704B2Molded flip chip packageINTEL CORP·Filed 2000·Granted Oct 14, 2003·31 cites·2 claims
- 0685US7132311B2Encapsulation of a stack of semiconductor diceINTEL CORP·Filed 2002·Granted Nov 7, 2006·41 cites·27 claims
- 0777USD837118SInstrument panelHONDA MOTOR CO LTD·Filed 2016·Granted Jan 1, 2019·24 cites·1 claims
- 0877US6838313B2Molded flip chip packageINTEL CORP·Filed 2003·Granted Jan 4, 2005·16 cites·17 claims
- 0970US10224290B2Electromagnetically shielded electronic devices and related systems and methodsINTEL CORP·Filed 2015·Granted Mar 5, 2019·2 cites·20 claims
- 1068US7132739B2Encapsulated stack of dice and support thereforINTEL CORP·Filed 2004·Granted Nov 7, 2006·14 cites·18 claims
- 1166US8969134B2Laser ablation tape for solder interconnect formationINTEL CORP·Filed 2013·Granted Mar 3, 2015·2 cites·20 claims
- 1265US7071572B2Pre-back-grind and underfill layer for bumped wafers and diesINTEL CORP·Filed 2004·Granted Jul 4, 2006·11 cites·23 claims
- 1358USD1036337SFront door lining for an automobileHONDA MOTOR CO LTD·Filed 2021·Granted Jul 23, 2024·3 cites·1 claims
- 1454US11173535B2Drilling jig and drilling method using this drilling jigHONDA ACCESS KK·Filed 2018·Granted Nov 16, 2021·0 cites·15 claims
- 1543US2022176887A1Interior structure of vehicle doorHONDA MOTOR CO LTD·Filed 2021·Application pending·0 cites
- 1640US2002114144A1Molded flip chip packageFiled 2002·Application pending·0 cites
- 1735US2002110956A1Chip lead framesFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →