Inventor · disambiguated record
Takahiro Kuroda
Also filed as: KURODA TAKAHIRO
22 granted patents·12 pending applications·33 citations·filing 2006–2024
91Inventor score
Files withRESONAC CORP9KONICA MINOLTA INC4KROSAKIHARIMA CORP3KURODA TAKAHIRO3SHOWA DENKO MATERIALS CO LTD3
Top patents by PatentIndex Score
34 records- 0186US9841707B2Image forming apparatus, control method, and control program in which a magnitude of a current to flow in a paper sheet at the time of toner image transfer can be setKONICA MINOLTA INC·Filed 2016·Granted Dec 12, 2017·3 cites·15 claims
- 0285US8037924B2Immersion nozzle for continuous castingKROSAKI HARIMA CORP·Filed 2009·Granted Oct 18, 2011·5 cites·9 claims
- 0383US10682696B2Immersion nozzle replacement methodKROSAKIHARIMA CORP·Filed 2017·Granted Jun 16, 2020·1 cites·15 claims
- 0483US9091968B2Image forming apparatus having transfer bias controlKONICA MINOLTA INC·Filed 2013·Granted Jul 28, 2015·3 cites·6 claims
- 0581US7732995B2Piezoelectric device and method for manufacturing the sameEPSON TOYOCOM CORP·Filed 2008·Granted Jun 8, 2010·13 cites·5 claims
- 0674US8862020B2Image forming apparatusNOGUCHI HIDETOSHI·Filed 2013·Granted Oct 14, 2014·2 cites·9 claims
- 0774US8644723B2Image forming apparatusSHIBUYA SATORU·Filed 2012·Granted Feb 4, 2014·2 cites·5 claims
- 0869US11251055B2Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2019·Granted Feb 15, 2022·1 cites·16 claims
- 0968US8293816B2Mixed aluminum hydroxide powderYAMAMOTO KAZUYUKI·Filed 2009·Granted Oct 23, 2012·1 cites·5 claims
- 1063US11682564B2Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·22 claims
- 1162US10288880B2Panel opening/closing devicePANASONIC IP MAN CO LTD·Filed 2017·Granted May 14, 2019·1 cites·7 claims
- 1262US2024335124A1Physiological information measurement device and physiological information measurement methodNIHON KOHDEN CORP·Filed 2024·Application pending·0 cites
- 1361US8909081B2Image forming apparatusHARA KAZUYOSHI·Filed 2012·Granted Dec 9, 2014·1 cites·4 claims
- 1459US2025266385A1Film adhesive, dicing/die bonding integrated film, and semiconductor device and method for producing sameRESONAC CORP·Filed 2024·Application pending·0 cites
- 1557US2025293077A1Film adhesive, dicing and die-bonding integral film, semiconductor device, and manufacturing method for sameRESONAC CORP·Filed 2024·Application pending·0 cites
- 1656US9195213B2Image forming apparatus including fan to generate air flow in conveyance path in sheet conveyance directionKONICA MINOLTA INC·Filed 2014·Granted Nov 24, 2015·0 cites·11 claims
- 1755US10799950B2Nozzle structureKROSAKIHARIMA CORP·Filed 2016·Granted Oct 13, 2020·0 cites·14 claims
- 1852US12435248B2Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulation molded body, and method for manufacturing semiconductor packageRESONAC CORP·Filed 2021·Granted Oct 7, 2025·0 cites·8 claims
- 1949US11908762B2Temporary protective film for semiconductor sealing molding, lead frame with temporary protective film, sealed molded body with temporary protective film, and method for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2019·Granted Feb 20, 2024·0 cites·16 claims
- 2048US2025226347A1Adhesive film for semiconductors, dicing die bonding film, and method for producing semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 2148US2025226348A1Adhesive film for semiconductors, dicing/die-bonding film, and method for manufacturing semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 2247US11054761B2Image forming apparatus and method of controlling the sameKONICA MINOLTA INC·Filed 2020·Granted Jul 6, 2021·0 cites·18 claims
- 2347US2023178385A1Temporary protection film for semiconductor encapsulation, production method therefor, lead frame with temporary protection film, temporarily protected encapsulation object, and method for producing semiconductor packageSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 2447US2025167034A1Integrated dicing/die bonding film, method for producing same, and method for producing semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 2544US12398298B2Temporary protective film for producing semiconductor device, reel body, and method for producing semiconductor deviceRESONAC CORP·Filed 2019·Granted Aug 26, 2025·0 cites·11 claims
- 2644US10220438B2Immersion nozzleKROSAKIHARIMA CORP·Filed 2015·Granted Mar 5, 2019·0 cites·19 claims
- 2744US2025006574A1Reinforced semiconductor chip production method, semiconductor chip with film, semiconductor chip reinforcement method, reinforcement film and semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 2842US2022285200A1Temporary protective film, reel body, packaging body, package body, temporary protective body, and method for producing semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
- 2941US9597962B2Display control device and display control programPANASONIC IP MAN CO LTD·Filed 2014·Granted Mar 21, 2017·0 cites·9 claims
- 3040US8744292B2Image forming apparatus and method for stopping driving image carrierSHIBUYA SATORU·Filed 2011·Granted Jun 3, 2014·0 cites·12 claims
- 3140US2024043722A1Film-like adhesive agent, dicing/die-bonding all-in-one film, semiconductor device, and method for manufacturing sameRESONAC CORP·Filed 2021·Application pending·0 cites
- 3231US8870041B2Immersion nozzle for continuous castingKURODA TAKAHIRO·Filed 2012·Granted Oct 28, 2014·0 cites·10 claims
- 3331US2012051765A1Image forming apparatus and method of controlling the sameKURODA TAKAHIRO·Filed 2011·Application pending·0 cites
- 3430US2006255691A1Piezoelectric resonator and manufacturing method thereofKURODA TAKAHIRO·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →