Inventor · disambiguated record
Taeksoo Kwak
Also filed as: KWAK TAEKSOO
7 granted patents·10 pending applications·1 citations·filing 2016–2024
69Inventor score
Files withSAMSUNG SDI CO LTD17
Top patents by PatentIndex Score
17 records- 0171US10106687B2Composition for forming silica layer, method for manufacturing silica layer and silica layerSAMSUNG SDI CO LTD·Filed 2016·Granted Oct 23, 2018·1 cites·12 claims
- 0265US2024393694A1Metal containing photoresist developer composition, and method of forming patterns including step of developing using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0363US2024393684A1Method of forming patternsSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0463US2024385515A1Method of forming patternsSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0563US2024393698A1Composition for removing edge beads from metal-containing resists, developer composition of metal-containing resists, and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0661US2025230355A1Composition for removing edge bead from metal containing resists, developer composition of metal containing resists, and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0756US2024385522A1Composition for removing edge beads from metal containing resists, and method of forming patterns including step of removing edge beads utilizing the composition, and a system of forming patternsSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0854US2024272556A1Metal containing photoresist developer composition, and method of forming patterns including step of developing using the compositionSAMSUNG SDI CO LTD·Filed 2023·Application pending·0 cites
- 0951US2024019784A1Metal containing photoresist developer composition, and method of forming patterns including step of developing using the compositionSAMSUNG SDI CO LTD·Filed 2023·Application pending·0 cites
- 1043US12264075B2Composition for forming silica layer and silica layerSAMSUNG SDI CO LTD·Filed 2020·Granted Apr 1, 2025·0 cites·16 claims
- 1143US11201052B2Composition for forming silica layer, silica layer and electronic device incorporating silica layerSAMSUNG SDI CO LTD·Filed 2020·Granted Dec 14, 2021·0 cites·13 claims
- 1242US10804095B2Composition for forming silica layer, silica layer, and electronic deviceSAMSUNG SDI CO LTD·Filed 2018·Granted Oct 13, 2020·0 cites·16 claims
- 1341US10017646B2Composition for forming silica layer, method for manufacturing silica layer, and electric device including silica layerSAMSUNG SDI CO LTD·Filed 2017·Granted Jul 10, 2018·0 cites·8 claims
- 1440US10153171B2Method of forming patterns, patterns formed according to the method, and semiconductor device including the patternsSAMSUNG SDI CO LTD·Filed 2017·Granted Dec 11, 2018·0 cites·11 claims
- 1539US2021324235A1Composition for forming silica layer, silica layer formed therefrom, and electronic device including silica layerSAMSUNG SDI CO LTD·Filed 2021·Application pending·0 cites
- 1634US11518909B2Composition for forming silica layer, manufacturing method for silica layer, and silica layerSAMSUNG SDI CO LTD·Filed 2018·Granted Dec 6, 2022·0 cites·12 claims
- 1731US2017250206A1Composition for forming silica layer, method for manufacturing silica layer, and silica layerSAMSUNG SDI CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →