Inventor · disambiguated record
Taek-Keun Lee
Also filed as: LEE TAEK-KEUN
3 granted patents·2 pending applications·12 citations·filing 2003–2013
62Inventor score
Top patents by PatentIndex Score
5 records- 0174US8350369B2High power semiconductor packageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Granted Jan 8, 2013·7 cites·43 claims
- 0274US8067826B2Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the packageSON JOON-SEO·Filed 2008·Granted Nov 29, 2011·5 cites·10 claims
- 0348US8945992B2Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the packageSON JOON-SEO·Filed 2011·Granted Feb 3, 2015·0 cites·9 claims
- 0438US2013307145A1Semiconductor package and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2013·Application pending·0 cites
- 0532US2004061206A1Discrete package having insulated ceramic heat sinkFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →