Inventor · disambiguated record
Tae Keun Lee
Also filed as: LEE TAE KEUN
35 granted patents·2 pending applications·339 citations·filing 1998–2023
96Inventor score
Top patents by PatentIndex Score
37 records- 0197US10991302B1Gate driving circuit and display device using the sameLG DISPLAY CO LTD·Filed 2020·Granted Apr 27, 2021·12 cites·18 claims
- 0295US11798482B2Gate driver and organic light emitting display device including the sameLG DISPLAY CO LTD·Filed 2022·Granted Oct 24, 2023·3 cites·20 claims
- 0394US9329424B2In-cell touch type liquid crystal display deviceLG DISPLAY CO LTD·Filed 2014·Granted May 3, 2016·12 cites·6 claims
- 0493US6060778ABall grid array packageHYUNDAI ELECTRONICS IND·Filed 1998·Granted May 9, 2000·252 cites·8 claims
- 0591US9429785B2In-cell touch type liquid crystal display deviceLG DISPLAY CO LTD·Filed 2016·Granted Aug 30, 2016·7 cites·13 claims
- 0678US12230213B2Gate driver and organic light emitting display device including the sameLG DISPLAY CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·16 claims
- 0778US11462174B2Plurality of scan driver having shared scan lines and display apparatus including the sameLG DISPLAY CO LTD·Filed 2021·Granted Oct 4, 2022·1 cites·11 claims
- 0875US8304874B2Stackable integrated circuit package systemLEE HUN TEAK·Filed 2006·Granted Nov 6, 2012·6 cites·20 claims
- 0975US8030755B2Integrated circuit package system with a heat sinkSTATS CHIPPAC LTD·Filed 2006·Granted Oct 4, 2011·7 cites·20 claims
- 1075US7714451B2Semiconductor package system with thermal die bondingSTATS CHIPPAC LTD·Filed 2006·Granted May 11, 2010·6 cites·12 claims
- 1174US7517729B2Integrated circuit package system with heat slugSTATS CHIPPAC LTD·Filed 2005·Granted Apr 14, 2009·5 cites·9 claims
- 1269US7759783B2Integrated circuit package system employing thin profile techniquesSTATS CHIPPAC LTD·Filed 2006·Granted Jul 20, 2010·4 cites·20 claims
- 1368US11367397B2Gate driver and organic light emitting display device including the sameLG DISPLAY CO LTD·Filed 2020·Granted Jun 21, 2022·0 cites·10 claims
- 1468US8729687B2Stackable integrated circuit package systemSTATS CHIPPAC LTD·Filed 2012·Granted May 20, 2014·2 cites·20 claims
- 1568US8227903B2Integrated circuit packaging system with encapsulant containment and method of manufacture thereofLEE HYE RAN·Filed 2010·Granted Jul 24, 2012·3 cites·20 claims
- 1667US7682872B2Integrated circuit package system with underfillSTATS CHIPPAC LTD·Filed 2008·Granted Mar 23, 2010·4 cites·18 claims
- 1763US7851268B2Integrated circuit package system using heat slugSTATS CHIPPAC LTD·Filed 2006·Granted Dec 14, 2010·3 cites·10 claims
- 1863US7705475B2Integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Granted Apr 27, 2010·2 cites·8 claims
- 1962US8853686B2Flat panel display device with oxide thin film transistor and method for fabricating the sameCHAE JI EUN·Filed 2012·Granted Oct 7, 2014·2 cites·14 claims
- 2062US7309622B2Integrated circuit package system with heat sinkSTATS CHIPPAC LTD·Filed 2006·Granted Dec 18, 2007·2 cites·8 claims
- 2160US8921861B2Flat panel display device with oxide thin film transistors and method for fabricating the sameCHAE JI EUN·Filed 2012·Granted Dec 30, 2014·1 cites·7 claims
- 2258US8114771B2Semiconductor wafer scale package systemJEON HYUNG JUN·Filed 2006·Granted Feb 14, 2012·2 cites·10 claims
- 2355US9583511B2Array substrate having integrated gate driver and method of fabricating the sameLG DISPLAY CO LTD·Filed 2014·Granted Feb 28, 2017·0 cites·11 claims
- 2455US8304922B2Semiconductor package system with thermal die bondingLEE SANGKWON·Filed 2010·Granted Nov 6, 2012·1 cites·7 claims
- 2554US12069904B2Light emitting diode display apparatusLG DISPLAY CO LTD·Filed 2021·Granted Aug 20, 2024·0 cites·30 claims
- 2654US8866224B2Display deviceLG DISPLAY CO LTD·Filed 2013·Granted Oct 21, 2014·1 cites·16 claims
- 2754US8035237B2Integrated circuit package system with heat slugSTATS CHIPPAC LTD·Filed 2009·Granted Oct 11, 2011·0 cites·9 claims
- 2852US10684711B2Subpixel structure of display device and touch screen-integrated display device having the sameLG DISPLAY CO LTD·Filed 2016·Granted Jun 16, 2020·0 cites·21 claims
- 2952US9165953B2Flat panel display device with oxide thin film transistors and method for fabricating the sameLG DISPLAY CO LTD·Filed 2014·Granted Oct 20, 2015·0 cites·6 claims
- 3045US8841782B2Integrated circuit package system with mold gateYANG DAEWOOK·Filed 2008·Granted Sep 23, 2014·0 cites·20 claims
- 3144US8633056B2Integrated circuit package system and method of manufacture thereofJEON HYUNG JUN·Filed 2010·Granted Jan 21, 2014·0 cites·18 claims
- 3244US8022531B2Integrated circuit package system using heat slugSTATS CHIPPAC LTD·Filed 2010·Granted Sep 20, 2011·0 cites·10 claims
- 3344US7521780B2Integrated circuit package system with heat dissipation enclosureSTATS CHIPPAC LTD·Filed 2006·Granted Apr 21, 2009·0 cites·20 claims
- 3444US6783848B2Matte biaxially oriented polypropylene film with improved matte property and processabilitySK CORP·Filed 2002·Granted Aug 31, 2004·1 cites·9 claims
- 3542US2015001741A1Semiconductor Device and Method of Forming an Interposer Including a Beveled EdgeSTATS CHIPPAC LTD·Filed 2013·Application pending·0 cites
- 3637US8470920B2Polyolefin composition for an interior sheet/filmKWON SANG MIN·Filed 2010·Granted Jun 25, 2013·0 cites·7 claims
- 3726US2012235318A1Method for fabricating a polyolefin sheet using a roller deviceKWON SANG MIN·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →