Inventor · disambiguated record
Tae-Gon Lee
Also filed as: LEE TAE GON
7 granted patents·5 pending applications·51 citations·filing 2004–2016
80Inventor score
Top patents by PatentIndex Score
12 records- 0183US7408261B2BGA package board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2004·Granted Aug 5, 2008·34 cites·11 claims
- 0281US7414317B2BGA package with concave shaped bonding padsSAMSUNG ELECTRO MECH·Filed 2005·Granted Aug 19, 2008·12 cites·22 claims
- 0366US7802361B2Method for manufacturing the BGA package boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Sep 28, 2010·3 cites·17 claims
- 0462US7768116B2Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted Aug 3, 2010·2 cites·3 claims
- 0553US2015049445A1Method for manufacturing electronic component embedding substrate and electronic component embedding substrateSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0650US2015085455A1Electronic component-embedded substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0747US2016212856A1Method for manufacturing electronic component embedding substrate and electronic component embedding substrateSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 0844US2009133902A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0942US8236690B2Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball padYOON KYOUNG RO·Filed 2010·Granted Aug 7, 2012·0 cites·3 claims
- 1040US8084696B2Printed circuit board and manufacturing method thereofKIM TAE-GUI·Filed 2009·Granted Dec 27, 2011·0 cites·6 claims
- 1138US8106308B2Printed circuit board for package and manufacturing method thereofJEON HYUNG-JIN·Filed 2007·Granted Jan 31, 2012·0 cites·11 claims
- 1233US2016338211A1Circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →