Inventor · disambiguated record
Tae Jong Lee
Also filed as: LEE TAE J · LEE TAE-JONG
48 granted patents·7 pending applications·615 citations·filing 2000–2023
98Inventor score
Files withCHARTERED SEMICONDUCTOR MFG17SAMSUNG ELECTRONICS CO LTD17GLOBALFOUNDRIES SG PTE LTD3LEE TAE-JONG3MAGNACHIP SEMICONDUCTOR LTD2
Top patents by PatentIndex Score
55 records- 0196US10096688B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 9, 2018·16 cites·20 claims
- 0296US6348385B1Method for a short channel CMOS transistor with small overlay capacitance using in-situ doped spacers with a low dielectric constantCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Feb 19, 2002·128 cites·12 claims
- 0394US9859393B2Integrated circuit device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 2, 2018·11 cites·20 claims
- 0492US10153277B2Integrated circuit device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 11, 2018·8 cites·14 claims
- 0590US9490258B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 8, 2016·10 cites·17 claims
- 0689US6319767B1Method to eliminate top metal corner shaping during bottom metal patterning for MIM capacitors via plasma ashing and hard masking techniqueCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Nov 20, 2001·50 cites·29 claims
- 0788US10074717B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 11, 2018·4 cites·20 claims
- 0887US7585768B2Combined copper plating method to improve gap fillCHARTERED SEMICONDUCTOR MFG·Filed 2006·Granted Sep 8, 2009·14 cites·12 claims
- 0987US7094669B2Structure and method of liner air gap formationCHARTERED SEMICONDUCTOR MFG·Filed 2004·Granted Aug 22, 2006·46 cites·29 claims
- 1087US6387747B1Method to fabricate RF inductors with minimum areaCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted May 14, 2002·57 cites·29 claims
- 1186US6355563B1Versatile copper-wiring layout design with low-k dielectric integrationCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Mar 12, 2002·46 cites·33 claims
- 1284US10593801B2Semiconductor devices and methods of fabricating the sameLEE TAE JONG·Filed 2016·Granted Mar 17, 2020·5 cites·22 claims
- 1383US10622444B2FinFET semiconductor device with a dummy gate, first gate spacer and second gate spacerSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 14, 2020·2 cites·20 claims
- 1483US6558994B2Dual silicon-on-insulator device wafer dieCHARTERED SEMICONDUCTORS MAUFA·Filed 2001·Granted May 6, 2003·36 cites·13 claims
- 1582US7253097B2Integrated circuit system using dual damascene processCHARTERED SEMICONDUCTOR MFG·Filed 2005·Granted Aug 7, 2007·11 cites·20 claims
- 1681US6284590B1Method to eliminate top metal corner shaping during bottom metal patterning for MIM capacitorsCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Sep 4, 2001·29 cites·27 claims
- 1780US12507448B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 23, 2025·0 cites·18 claims
- 1879US10541127B2Material layers, semiconductor devices including the same, and methods of fabricating material layers and semiconductor devicesTAK YONG SUK·Filed 2016·Granted Jan 21, 2020·4 cites·16 claims
- 1979US10460927B2Methods of fabricating a SiOCN layer using a first and second carbon precursor, the first carbon precursor being different from the second carbon precursorSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 29, 2019·2 cites·18 claims
- 2079US6613652B2Method for fabricating SOI devices with option of incorporating air-gap feature for better insulation and performanceCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Sep 2, 2003·28 cites·33 claims
- 2176US7989338B2Grain boundary blocking for stress migration and electromigration improvement in CU interconnectsGLOBALFOUNDRIES SG PTE LTD·Filed 2005·Granted Aug 2, 2011·8 cites·22 claims
- 2275US8047275B2Ground water restoration type terrestrial heat exchanger using auto temperature bypass apparatusKOREA INST GEOSCIENCE & MINERA·Filed 2009·Granted Nov 1, 2011·6 cites·1 claims
- 2374US7224060B2Integrated circuit with protective moatCHARTERED SEMICONDUCTOR MFG·Filed 2004·Granted May 29, 2007·25 cites·24 claims
- 2473US6376360B1Effective retardation of fluorine radical attack on metal lines via use of silicon rich oxide spacersCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 23, 2002·20 cites·22 claims
- 2572US9054107B2Reliable interconnect for semiconductor deviceGLOBALFOUNDRIES SG PTE LTD·Filed 2013·Granted Jun 9, 2015·2 cites·20 claims
- 2670US11515390B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 2770US11409529B2RISC-V implemented processor with hardware acceleration supporting user defined instruction set and method thereofZARAM TECH CO LTD·Filed 2019·Granted Aug 9, 2022·2 cites·10 claims
- 2870US11061052B2Probe including an alignment key protruded from a side of an alignment beam and a probe card including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 13, 2021·1 cites·16 claims
- 2970US6432797B1Simplified method to reduce or eliminate STI oxide divotsCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Aug 13, 2002·13 cites·31 claims
- 3068US8598031B2Reliable interconnect for semiconductor deviceZHANG FAN·Filed 2009·Granted Dec 3, 2013·2 cites·21 claims
- 3166US11610966B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 21, 2023·0 cites·19 claims
- 3266US6468880B1Method for fabricating complementary silicon on insulator devices using wafer bondingCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Oct 22, 2002·14 cites·14 claims
- 3363US9110100B2Circuit module and battery pack including the sameLEE TAE-JONG·Filed 2011·Granted Aug 18, 2015·2 cites·16 claims
- 3462US11271110B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 8, 2022·0 cites·16 claims
- 3558US10529555B2Methods of fabricating a SiOCN layer using a first and second carbon precursor, the first carbon precursor being different from the second carbon precursorSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 7, 2020·0 cites·18 claims
- 3658US9576433B2Method and system to replace a betting action in advance of a user turn in virtual card game servicesKIM KI YONG·Filed 2008·Granted Feb 21, 2017·0 cites·15 claims
- 3757US6849928B2Dual silicon-on-insulator device wafer dieCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Feb 1, 2005·6 cites·10 claims
- 3856US10770467B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 8, 2020·0 cites·13 claims
- 3953US9746575B2Induction type broadband 3-component borehole magnetic measuring sensor and borehole electromagnetic tomography method using the sameKOREA INST GEOSCIENCE & MINERAL RESOURCES·Filed 2014·Granted Aug 29, 2017·1 cites·19 claims
- 4051US10163913B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 25, 2018·0 cites·8 claims
- 4149US10269218B2Method and system for providing card game servicesNHN ENTERTAINMENT CORP·Filed 2017·Granted Apr 23, 2019·0 cites·9 claims
- 4249US9362207B2Metal wiring of semiconductor device and method for manufacturing the sameMAGNACHIP SEMICONDUCTOR LTD·Filed 2012·Granted Jun 7, 2016·0 cites·27 claims
- 4349US6967156B2Method to fabricate aligned dual damascene openingsCHARTERED SEMICONDUCTOR MFG·Filed 2003·Granted Nov 22, 2005·3 cites·32 claims
- 4448US2016233157A1Slot designs in wide metal linesGLOBALFOUNDRIES SG PTE LTD·Filed 2016·Application pending·0 cites
- 4547US9558992B2Metal wiring of semiconductor device and method for manufacturing the sameMAGNACHIP SEMICONDUCTOR LTD·Filed 2016·Granted Jan 31, 2017·0 cites·11 claims
- 4646US7372156B2Method to fabricate aligned dual damascene openingsCHARTERED SEMICONDUCTOR MFG·Filed 2005·Granted May 13, 2008·0 cites·17 claims
- 4746US7276440B2Method of fabrication of a die oxide ringCHARTERED SEMICONDUCTOR MFG·Filed 2003·Granted Oct 2, 2007·2 cites·7 claims
- 4846US2007176225A1Semiconductor device and method of manufacturing the sameLEE SANG-HOON·Filed 2007·Application pending·0 cites
- 4945US2011129705A1Battery Pack for Preventing Damage Due to External ShockSAMSUNG SDI CO LTD·Filed 2010·Application pending·0 cites
- 5044US9318378B2Slot designs in wide metal linesLIM YEOW KHENG·Filed 2004·Granted Apr 19, 2016·1 cites·18 claims
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →