Inventor · disambiguated record
Ta-Hsuan Lin
Also filed as: LIN TA-HSUAN
2 granted patents·6 pending applications·2 citations·filing 2010–2025
36Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0174US2025329623A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0270US2025140667A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0359US8633558B2Package structure for a chip and method for fabricating the sameLIN TA-HSUAN·Filed 2010·Granted Jan 21, 2014·2 cites·19 claims
- 0459US2025253222A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0557US2025125223A1Passivation structure and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0656US2025149524A1Package structure including a redistribution layer (rdl) structure with a recessed portion and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0754US2025062202A1Package structure, semiconductor die and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0842US11682654B2Semiconductor structure having a sensor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 20, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →