Inventor · disambiguated record
Takaharu Mae
Also filed as: MAE TAKAHARU
21 granted patents·1 pending application·187 citations·filing 1986–2007
95Inventor score
Top patents by PatentIndex Score
22 records- 0179US7296727B2Apparatus and method for mounting electronic componentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Nov 20, 2007·27 cites·26 claims
- 0277US7014092B2Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Mar 21, 2006·16 cites·9 claims
- 0376US6302317B1Bump bonding apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Oct 16, 2001·28 cites·6 claims
- 0472US6329640B1Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor waferMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Dec 11, 2001·13 cites·16 claims
- 0569US7516878B2Bump formation method and bump forming apparatus for semiconductor waferPANASONIC CORP·Filed 2005·Granted Apr 14, 2009·2 cites·6 claims
- 0669US6494358B2Bump bonding apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Dec 17, 2002·10 cites·7 claims
- 0763US6910613B2Device and method for forming bumpMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 28, 2005·8 cites·12 claims
- 0860US7350684B2Apparatus and method for forming bumpMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Apr 1, 2008·2 cites·13 claims
- 0960US6568580B2Bump bonding apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 27, 2003·6 cites·2 claims
- 1059US7052984B2Bump formation method and bump forming apparatus for semiconductor waferMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 30, 2006·6 cites·24 claims
- 1159US4763811AParts feederMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1986·Granted Aug 16, 1988·18 cites·18 claims
- 1256US7387229B2Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus thereforeMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jun 17, 2008·4 cites·7 claims
- 1356US6098868ABump forming method and bump bonderMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Aug 8, 2000·23 cites·2 claims
- 1454US7005368B1Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 28, 2006·3 cites·8 claims
- 1554US2008179378A1Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus thereforeIMANISHI MAKOTO·Filed 2007·Application pending·0 cites
- 1653US6392202B2Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor waferMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 21, 2002·3 cites·4 claims
- 1749US7861908B2Component mounting method, component mounting apparatus, and ultrasonic bonding headPANASONIC CORP·Filed 2007·Granted Jan 4, 2011·0 cites·14 claims
- 1847US7031509B2Method and apparatus for correcting inclination of IC on semiconductor waferMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Apr 18, 2006·2 cites·15 claims
- 1945US6619535B1Working method for holding a work object by suctionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Sep 16, 2003·13 cites·10 claims
- 2040US7229854B2Electronic component mounting method and apparatus and ultrasonic bonding headMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 12, 2007·0 cites·7 claims
- 2140US6818975B1Electric charge generating semiconductor substrate bump forming device, method of removing electric charge from electric charge generating semiconductor substrate device for removing electric charge from electric charge generating semiconductor substrate, and electric charge generating semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Nov 16, 2004·0 cites·29 claims
- 2234US6787391B1Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Sep 7, 2004·3 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →