Inventor · disambiguated record
Taketoshi Maeda
Also filed as: MAEDA TAKETOSHI
2 granted patents·3 pending applications·2 citations·filing 2018–2025
38Inventor score
Top patents by PatentIndex Score
5 records- 0173US11004761B2Packaging of a semiconductor device with dual sealing materialsMITSUBISHI ELECTRIC CORP·Filed 2018·Granted May 11, 2021·2 cites·7 claims
- 0258US12183647B2Packaging of a semiconductor device with dual sealing materialsMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Dec 31, 2024·0 cites·12 claims
- 0356US2025217895A1Information processing device and programTRYGLE CO LTD·Filed 2025·Application pending·0 cites
- 0448US2023080190A1Information processing device and programTRYGLE CO LTD·Filed 2021·Application pending·0 cites
- 0545US2025316613A1Semiconductor device and method for manufacturing of semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →