Inventor · disambiguated record

Takashi Makinoshima

Also filed as: MAKINOSHIMA TAKASHI

19 granted patents·39 pending applications·64 citations·filing 2005–2022

91Inventor score

Technology areasH10P C08G G03F C08L C07C

Files withMITSUBISHI GAS CHEMICAL CO56 MAKINOSHIMA TAKASHI2

Top patents by PatentIndex Score

58 records

0194US7871554B2Process for producing polyimide filmMITSUBISHI GAS CHEMICAL CO·Filed 2006·Granted Jan 18, 2011·44 cites·12 claims
0285US7659360B2Low water-absorptive polyimide resin and method for producing sameMITSUBISHI GAS CHEMICAL CO·Filed 2005·Granted Feb 9, 2010·6 cites·14 claims
0383US11572430B2Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2020·Granted Feb 7, 2023·1 cites·1 claims
0482US11243467B2Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Feb 8, 2022·2 cites·13 claims
0576US10577323B2Compound, resin, material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography, pattern forming method, and method for purifying compound or resinMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Mar 3, 2020·1 cites·12 claims
0676US10294183B2Compound, resin, material for forming underlayer film for lithography, underlayer film for lithography, pattern forming method, and method for purifying the compound or resinMITSUBISHI GAS CHEMICAL CO·Filed 2015·Granted May 21, 2019·1 cites·25 claims
0775US11137686B2Material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography and production method thereof, and resist pattern forming methodMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Oct 5, 2021·2 cites·10 claims
0875US10747112B2Compound, resin, and purification method thereof, material for forming underlayer film for lithography, composition for forming underlayer film, and underlayer film, as well as resist pattern forming method and circuit pattern forming methodMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Aug 18, 2020·2 cites·22 claims
0972US10364314B2Compound, resin, material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography, resist pattern forming method, circuit pattern forming method, and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Jul 30, 2019·2 cites·21 claims
1072US9920024B2Method for purifying compound or resinMITSUBISHI GAS CHEMICAL CO·Filed 2014·Granted Mar 20, 2018·1 cites·13 claims
1170US11143962B2Material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography and production method thereof, pattern forming method, resin, and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Oct 12, 2021·1 cites·17 claims
1262US9809601B2Compound, material for forming underlayer film for lithography, underlayer film for lithography and pattern forming methodMITSUBISHI GAS CHEMICAL CO·Filed 2014·Granted Nov 7, 2017·1 cites·16 claims
1359US2024367098A1Carbon dioxide absorbent, method for recovering carbon dioxide, and apparatus for separating and recovering carbon dioxideMITSUBISHI GAS CHEMICAL CO·Filed 2022·Application pending·0 cites
1457US2022144738A1Compound, resin, composition, resist pattern formation method, circuit pattern formation method, and method for purifying resinMITSUBISHI GAS CHEMICAL CO·Filed 2020·Application pending·0 cites
1555US2022089810A1Polycyclic polyphenolic resin and method for producing polycyclic polyphenolic resinMITSUBISHI GAS CHEMICAL CO·Filed 2020·Application pending·0 cites
1655US2022064137A1Compound, resin, composition, resist pattern formation method, circuit pattern formation method, and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
1754US2021206901A1Compound, composition containing the same, method for forming resist pattern and method for forming insulating filmMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
1853US2022019146A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming patternMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
1953US2023314942A1Polycyclic polyphenolic resin, composition, method for producing polycyclic polyphenolic resin, composition for film formation, resist composition, resist pattern formation method, radiation-sensitive composition, composition for underlayer film formation for lithography, method for producing underlayer film for lithography, circuit pattern formation method, and composition for optical member formationMITSUBISHI GAS CHEMICAL CO·Filed 2021·Application pending·0 cites
2053US2021331994A1Compound, composition containing the same, method for forming resist pattern and method for forming insulating filmMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
2152US2022010072A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming patternMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
2251US2020354501A1Composition for film formation for lithography, film for lithography, method for forming resist pattern, and method for forming circuit patternMITSUBISHI GAS CHEMICAL CO·Filed 2018·Application pending·0 cites
2351US2021047457A1Compound, resin, composition and pattern formation methodMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
2450US2024109997A1Resin, composition, resist pattern formation method, circuit pattern formation method and method for purifying resinMITSUBISHI GAS CHEMICAL CO·Filed 2022·Application pending·0 cites
2550US2023333469A1Film forming composition for lithography, resist pattern formation method, and circuit pattern formation methodMITSUBISHI GAS CHEMICAL CO·Filed 2021·Application pending·0 cites
2650US2022348698A1Compound, polymer, composition, composition for film formation, pattern formation method, insulating film formation method, and method for producing compound, as well as method for producing iodine-containing vinyl polymer and acetylated derivative thereofMITSUBISHI GAS CHEMICAL CO·Filed 2020·Application pending·0 cites
2748US11747728B2Compound, resin, composition, resist pattern formation method, circuit pattern formation method and method for purifying resinMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Sep 5, 2023·0 cites·18 claims
2848US2023296982A1Polymer, composition, method for producing polymer, composition, composition for film formation, resist composition, radiation-sensitive composition, composition for underlayer film formation for lithography, resist pattern formation method, method for producing underlayer film for lithography, circuit pattern formation method, and composition for optical member formationMITSUBISHI GAS CHEMICAL CO·Filed 2021·Application pending·0 cites
2947US2008020217A1Colorless Transparent Polyimide Composite Film and Method for Producing SameMAKINOSHIMA TAKASHI·Filed 2005·Application pending·0 cites
3047US2023324801A1Underlayer film forming composition for lithography, underlayer film, and pattern formation methodMITSUBISHI GAS CHEMICAL CO·Filed 2021·Application pending·0 cites
3146US9828355B2Compound, material for forming underlayer film for lithography, underlayer film for lithography and pattern forming methodMITSUBISHI GAS CHEMICAL CO·Filed 2014·Granted Nov 28, 2017·0 cites·10 claims
3246US2022260910A1Underlayer film forming composition for lithography, underlayer film for lithography, and pattern formation method and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2020·Application pending·0 cites
3346US2021309595A1Composition for forming optical component, optical component, compound, and resinMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
3446US2024117101A1Composition for film formation, resist composition, radiation-sensitive composition, method for producing amorphous film, resist pattern formation method, composition for underlayer film formation for lithography, method for producing underlayer film for lithography, circuit pattern formation method, composition for optical member formation, resin for underlayer film formation, resist resin, radiation-sensitive resin, and resin for underlayer film formation for lithographyMITSUBISHI GAS CHEMICAL CO·Filed 2021·Application pending·0 cites
3545US2020002307A1Method for purifying compound or resin and method for producing compositionMITSUBISHI GAS CHEMICAL CO·Filed 2018·Application pending·0 cites
3644US2021018841A1Composition for resist underlayer film formation and pattern formation methodMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
3744US2014114000A1Flameproofed alicyclic polyimide resin composition and thin-walled molded body of sameMAKINOSHIMA TAKASHI·Filed 2012·Application pending·0 cites
3844US2021116813A1Composition for resist underlayer film formation, underlayer film for lithography, and pattern formation methodMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
3944US2020247739A1Compound, resin, composition, pattern formation method, and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2018·Application pending·0 cites
4043US10310377B2Material for forming film for lithography, composition for forming film for lithography, film for lithography, pattern forming method and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2015·Granted Jun 4, 2019·0 cites·17 claims
4143US2021294214A1Underlayer film forming compositionMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
4243US2022089811A1Composition for film formation, resist composition, radiation-sensitive composition, method for producing amorphous film, resist pattern formation method, composition for underlayer film formation for lithography, method for producing underlayer film for lithography, and circuit pattern formation methodMITSUBISHI GAS CHEMICAL CO·Filed 2020·Application pending·0 cites
4342US10745372B2Compound, resin, material for forming underlayer film for lithography, underlayer film for lithography, pattern forming method, and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2015·Granted Aug 18, 2020·0 cites·11 claims
4442US2021405529A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming patternMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
4542US2021003921A1Compound, resin, composition, and film forming material for lithography using the sameMITSUBISHI GAS CHEMICAL CO·Filed 2018·Application pending·0 cites
4642US2022155682A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, method for forming pattern, and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2020·Application pending·0 cites
4742US2021165327A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming patternMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
4842US2020172470A1Novel (poly)amine compound, resin and cured productMITSUBISHI GAS CHEMICAL CO·Filed 2018·Application pending·0 cites
4941US2021278767A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming patternMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
5040US12134596B2Compound, resin, composition, resist pattern formation method, circuit pattern formation method and method for purifying resinMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Nov 5, 2024·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →