Inventor · disambiguated record
Takuya Maruyama
Also filed as: MARUYAMA TAKUYA
22 granted patents·4 pending applications·53 citations·filing 2004–2025
92Inventor score
Files withSONY SEMICONDUCTOR SOLUTIONS CORP16RENESAS ELECTRONICS CORP4AISIN CORP1IWASHITA KAZUKI1NEC ELECTRONICS CORP1
Top patents by PatentIndex Score
26 records- 0193US11378659B2Light reception device and distance measurement moduleSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Jul 5, 2022·5 cites·20 claims
- 0290US12414346B2Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2022·Granted Sep 9, 2025·1 cites·10 claims
- 0390US11652175B2Light reception device and distance measurement moduleSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted May 16, 2023·3 cites·10 claims
- 0490US11075236B2Solid-state imaging device and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Jul 27, 2021·7 cites·20 claims
- 0587US12143735B2Solid-state imaging device and imaging deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Nov 12, 2024·2 cites·19 claims
- 0687US9337093B2Method of manufacturing semiconductor deviceOSHIDA DAISUKE·Filed 2011·Granted May 10, 2016·10 cites·4 claims
- 0786US11688747B2Solid-state imaging device and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Jun 27, 2023·1 cites·19 claims
- 0884US8854156B2Thin-film piezoelectric resonator and thin-film piezoelectric filter using the sameIWASHITA KAZUKI·Filed 2010·Granted Oct 7, 2014·13 cites·20 claims
- 0979US12199114B2Solid-state imaging device and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 1079US11079476B2Light-receiving element and distance measurement moduleSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Aug 3, 2021·2 cites·14 claims
- 1178US11536321B2Manufacturing method of tooth part, tooth part, and processing device of tooth partAISIN CORP·Filed 2019·Granted Dec 27, 2022·2 cites·4 claims
- 1277US12027540B2Solid-state imaging device and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Granted Jul 2, 2024·0 cites·20 claims
- 1376US11916154B2Light receiving element and ranging module having a plurality of pixels that each includes voltage application units and charge detection unitsSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Granted Feb 27, 2024·0 cites·24 claims
- 1469US10692910B2Solid-state imaging element and electronic deviceSONY CORP·Filed 2017·Granted Jun 23, 2020·1 cites·19 claims
- 1568US11538942B2Light receiving element and ranging module having light receiving regions and an isolation portion between adjacent light receiving regionsSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Dec 27, 2022·1 cites·24 claims
- 1663US9553121B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Jan 24, 2017·1 cites·14 claims
- 1762US2025276526A1Method for manufacturing ink containerSEIKO EPSON CORP·Filed 2025·Application pending·0 cites
- 1858US2025169137A1Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1956US12474479B2Light receiving element and distance measuring deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Nov 18, 2025·0 cites·18 claims
- 2054US11670664B2Light-receiving element and distance measurement module using indirect time of flightSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Jun 6, 2023·0 cites·11 claims
- 2153US7199058B2Method of manufacturing a semiconductor device and apparatus for manufacturing a semiconductor deviceNEC ELECTRONICS CORP·Filed 2004·Granted Apr 3, 2007·4 cites·14 claims
- 2252US2024387593A1Solid-state imaging deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 2350US12149839B2Solid-state imaging device with transistor drain connected to sense node of logarithmic conversion circuitSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Nov 19, 2024·0 cites·20 claims
- 2449US12158542B2Light-receiving element and distance-measuring moduleSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Dec 3, 2024·0 cites·13 claims
- 2549US11545502B2Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2020·Granted Jan 3, 2023·0 cites·12 claims
- 2645US2021320218A1Light-receiving element and distance-measuring moduleSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →