Inventor · disambiguated record
Takumi Masuyama
Also filed as: MASUYAMA TAKUMI
6 granted patents·5 pending applications·9 citations·filing 2010–2018
72Inventor score
Files withFUJITSU LTD11
Top patents by PatentIndex Score
11 records- 0185US9536857B1Heating header of semiconductor mounting apparatus and bonding method for semiconductorFUJITSU LTD·Filed 2016·Granted Jan 3, 2017·5 cites·5 claims
- 0278US9905528B2Semiconductor mounting apparatus, head thereof, and method for manufacturing laminated chipFUJITSU LTD·Filed 2016·Granted Feb 27, 2018·3 cites·8 claims
- 0363US9793221B2Semiconductor device mounting methodFUJITSU LTD·Filed 2016·Granted Oct 17, 2017·1 cites·14 claims
- 0454US10586770B2Optical moduleFUJITSU LTD·Filed 2018·Granted Mar 10, 2020·0 cites·10 claims
- 0554US10444450B2Optical moduleFUJITSU LTD·Filed 2018·Granted Oct 15, 2019·0 cites·9 claims
- 0647US2014078700A1Circuit board device and electronic deviceFUJITSU LTD·Filed 2013·Application pending·0 cites
- 0744US9053262B2Method of determining reinforcement position of circuit substrate and substrate assemblyFUJITSU LTD·Filed 2012·Granted Jun 9, 2015·0 cites·3 claims
- 0841US2013322057A1Heat transfer cap and repairing apparatus and methodFUJITSU LTD·Filed 2013·Application pending·0 cites
- 0941US2013256022A1Wiring board and method for manufacturing wiring boardFUJITSU LTD·Filed 2013·Application pending·0 cites
- 1039US2010326726A1Solder joint structure, electronic device using the same, and solder bonding methodFUJITSU LTD·Filed 2010·Application pending·0 cites
- 1138US2018217343A1Optical moduleFUJITSU LTD·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Takumi Masuyama files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →