Inventor · disambiguated record
Takeshi Matsunuma
Also filed as: MATSUNUMA TAKESHI
17 granted patents·8 pending applications·32 citations·filing 2000–2024
89Inventor score
Files withSONY SEMICONDUCTOR SOLUTIONS CORP10SONY CORP6MITSUBISHI ELECTRIC CORP3RENESAS TECH CORP2SONY GROUP CORP2
Top patents by PatentIndex Score
25 records- 0195US11929380B2Solid-state image-capturing element having floation diffusion and hollow regionsSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Mar 12, 2024·2 cites·12 claims
- 0290US8530820B2Solid-state imaging device with overflow drain region and contact thereto in different stacked substratesMATSUNUMA TAKESHI·Filed 2010·Granted Sep 10, 2013·16 cites·15 claims
- 0387US10396116B2Solid-state image-capturing element and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Aug 27, 2019·4 cites·15 claims
- 0485US2025072136A1Semiconductor Device, Solid-State Image Pickup Element, Imaging Device, and Electronic ApparatusSONY GROUP CORP·Filed 2024·Application pending·0 cites
- 0582US10797097B2Solid-state image-capturing element and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Oct 6, 2020·2 cites·20 claims
- 0671US11183528B2Solid-state image-capturing element and having floating diffusion and hollow regionsSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Nov 23, 2021·0 cites·14 claims
- 0767US8878121B2Solid-state imaging device with overflow drain region and contract thereto in different stacked substratesSONY CORP·Filed 2013·Granted Nov 4, 2014·0 cites·14 claims
- 0864US12306342B2Optical detection device and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Granted May 20, 2025·0 cites·26 claims
- 0963US2022149103A1Solid-state image-capturing element and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Application pending·0 cites
- 1062US11004879B2Semiconductor device, solid-state image pickup element, imaging device, and electronic apparatusSONY CORP·Filed 2020·Granted May 11, 2021·0 cites·20 claims
- 1161US2021233946A1Semiconductor device, solid-state image pickup element, imaging device, and electronic apparatusSONY GROUP CORP·Filed 2021·Application pending·0 cites
- 1253US10665623B2Semiconductor device, solid-state image pickup element, imaging device, and electronic apparatusSONY CORP·Filed 2016·Granted May 26, 2020·0 cites·14 claims
- 1352US12402428B2Method for manufacturing light detection device, light detection device, and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Aug 26, 2025·0 cites·20 claims
- 1452US11457201B2Imaging device and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Sep 27, 2022·0 cites·17 claims
- 1552US6482554B2Method for manufacturing a semiconductor device, photolithography mask and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Nov 19, 2002·4 cites·9 claims
- 1651US11424279B2Imaging element and electronic device including imaging deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Aug 23, 2022·0 cites·20 claims
- 1751US8007962B2PhotomaskSONY CORP·Filed 2009·Granted Aug 30, 2011·0 cites·7 claims
- 1849US6603163B2Semiconductor device with capacitor and method of manufacturing thereofMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Aug 5, 2003·4 cites·4 claims
- 1947US10665629B2Imaging device for reducing luminace unevennessSONY CORP·Filed 2017·Granted May 26, 2020·0 cites·18 claims
- 2039US10373994B2Image sensor, for suppressing occurrence of noise componentsSONY CORP·Filed 2013·Granted Aug 6, 2019·0 cites·12 claims
- 2137US2004121593A1Method for manufacturing semiconductor device through use of mask materialRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 2236US2003064599A1Pattern forming methodFiled 2002·Application pending·0 cites
- 2336US2004192008A1Semiconductor device including interconnection and capacitor, and method of manufacturing the sameRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 2436US2003067053A1Semiconductor device with capacitor and method of manufacturing thereofMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 2534US2017243819A1Stacked device, manufacturing method, and electronic instrumentSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →