Inventor · disambiguated record
Tadaaki Mimura
Also filed as: MIMURA TADAAKI
10 granted patents·3 pending applications·237 citations·filing 1996–2012
90Inventor score
Technology areasH10W
Top patents by PatentIndex Score
13 records- 0188US7312530B2Semiconductor device with multilayered metal patternMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Dec 25, 2007·43 cites·12 claims
- 0284US7391114B2Electrode pad section for external connectionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jun 24, 2008·17 cites·10 claims
- 0383US5767009AStructure of chip on chip mounting preventing from crosstalk noiseMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jun 16, 1998·66 cites·10 claims
- 0482US7741207B2Semiconductor device with multilayered metal patternPANASONIC CORP·Filed 2007·Granted Jun 22, 2010·9 cites·11 claims
- 0579US5821625AStructure of chip on chip mounting preventing from crosstalk noiseMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Oct 13, 1998·53 cites·3 claims
- 0675US7170189B2Semiconductor wafer and testing method thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jan 30, 2007·7 cites·18 claims
- 0770US5805865ASemiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Sep 8, 1998·40 cites·14 claims
- 0865US7999256B2Semiconductor devicePANASONIC CORP·Filed 2008·Granted Aug 16, 2011·2 cites·17 claims
- 0954US8669555B2Semiconductor devicePANASONIC CORP·Filed 2012·Granted Mar 11, 2014·0 cites·19 claims
- 1050US2009289357A1Semiconductor element and semiconductor device using the sameFUJIMOTO HIROAKI·Filed 2009·Application pending·0 cites
- 1147US8338829B2Semiconductor deviceTAKAHASHI MASAO·Filed 2011·Granted Dec 25, 2012·0 cites·19 claims
- 1246US2011233772A1Semiconductor element and semiconductor device using the samePANASONIC CORP·Filed 2011·Application pending·0 cites
- 1341US2007023927A1Semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →