Inventor · disambiguated record
Taehong Min
Also filed as: MIN TAEHONG
4 granted patents·7 pending applications·2 citations·filing 2016–2024
57Inventor score
Top patents by PatentIndex Score
11 records- 0170US9679821B2Methods of revising overlay correction dataSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 13, 2017·2 cites·15 claims
- 0260US2025336882A1Substrate alignment methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0360US2025308978A1Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0459US2025176108A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 0558US2025176103A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 0658US2025218849A1Wafer bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0754US11620937B2Light source device and light emission control methodSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 4, 2023·0 cites·14 claims
- 0854US2025040156A1Memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0948US2025062297A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1045US10825777B2Method of fabricating a semiconductor device with an overlay key patternSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 3, 2020·0 cites·19 claims
- 1142US11805710B2Method of fabricating three-dimensional semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →