Inventor · disambiguated record
Takao Miwa
Also filed as: MIWA TAKAO
45 granted patents·11 pending applications·1,052 citations·filing 1976–2015
98Inventor score
Top patents by PatentIndex Score
56 records- 0196US7455901B2Fiber-reinforced composite material, method for manufacturing the same and applications thereofUNIV KYOTO·Filed 2006·Granted Nov 25, 2008·36 cites·16 claims
- 0294US6028364ASemiconductor device having a stress relieving mechanismHITACHI LTD·Filed 1995·Granted Feb 22, 2000·167 cites·19 claims
- 0394US5565706ALSI package boardHITACHI LTD·Filed 1995·Granted Oct 15, 1996·190 cites·24 claims
- 0491US6621154B1Semiconductor apparatus having stress cushioning layerHITACHI LTD·Filed 2000·Granted Sep 16, 2003·65 cites·29 claims
- 0588US6845635B2Method of manufacturing glass substrate for information recording media, glass substrate for information recording media manufactured using the method, and information recording medium using the glass substrateHOYA CORP·Filed 2001·Granted Jan 25, 2005·45 cites·35 claims
- 0686US7586755B2Electronic circuit componentHITACHI LTD·Filed 2007·Granted Sep 8, 2009·11 cites·7 claims
- 0785US7183650B2Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrateRENESAS TECH CORP·Filed 2002·Granted Feb 27, 2007·30 cites·11 claims
- 0885US4427743ALaminated panelNIPPON SHEET GLASS CO LTD·Filed 1982·Granted Jan 24, 1984·44 cites·13 claims
- 0983US7691473B2Fiber-reinforced composite material, method for manufacturing the same, and applications thereofROHM CO LTD·Filed 2008·Granted Apr 6, 2010·4 cites·18 claims
- 1083US6423571B2Method of making a semiconductor device having a stress relieving mechanismHITACHI LTD·Filed 2001·Granted Jul 23, 2002·35 cites·19 claims
- 1181US5046343AInsert-molded card keyFUKI COMPANY LTD·Filed 1989·Granted Sep 10, 1991·41 cites·6 claims
- 1281US4891055AMethod of forming glass product having smooth surfaceNIPPON SHEET GLASS CO LTD·Filed 1988·Granted Jan 2, 1990·30 cites·6 claims
- 1377US6933601B2Semiconductor connection substrateHITACHI LTD·Filed 2002·Granted Aug 23, 2005·24 cites·26 claims
- 1477US6348741B1Semiconductor apparatus and a manufacturing method thereofHITACHI LTD·Filed 2000·Granted Feb 19, 2002·25 cites·22 claims
- 1575US5858584APositive photosensitive resin composition and electronic apparatus using the sameHITACHI LTD·Filed 1997·Granted Jan 12, 1999·29 cites·10 claims
- 1672US4102944ALow profile unsaturated polyester resin compositionSUMITOMO CHEMICAL CO·Filed 1976·Granted Jul 25, 1978·22 cites·13 claims
- 1771US7790248B2Active matrix type liquid crystal display apparatusHITACHI LTD·Filed 2007·Granted Sep 7, 2010·2 cites·11 claims
- 1871US6047098APlastic optical waveguide and optical switch using sameHITACHI LTD·Filed 1998·Granted Apr 4, 2000·22 cites·10 claims
- 1969US7304734B2Fluorescence analysis optical multiplexer/demultiplexer, fluorescence analysis optical module, fluorescence analyzer, fluorescence/photothermal conversion spectroscopic analyzer, and fluorescence analysis chipNIPPON SHEET GLASS CO LTD·Filed 2006·Granted Dec 4, 2007·2 cites·29 claims
- 2069US6756441B2Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereofHITACHI LTD·Filed 2001·Granted Jun 29, 2004·9 cites·9 claims
- 2168US5768108AMulti-layer wiring structureHITACHI LTD·Filed 1996·Granted Jun 16, 1998·35 cites·16 claims
- 2261US7535106B2Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrateRENESAS TECH CORP·Filed 2007·Granted May 19, 2009·1 cites·2 claims
- 2361US7294905B2Thin film capacitor and electronic circuit componentHITACHI LTD·Filed 2002·Granted Nov 13, 2007·10 cites·15 claims
- 2461US2008221261A1Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereofHITACHI LTD·Filed 2008·Application pending·0 cites
- 2560US5208066AProcess of forming a patterned polyimide film and articles including such a filmHITACHI LTD·Filed 1992·Granted May 4, 1993·29 cites·36 claims
- 2658US6930140B2Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereofHITACHI LTD·Filed 2003·Granted Aug 16, 2005·2 cites·6 claims
- 2756US8722137B2Hydrated water-absorption polymer containing resin composition, porous body and insulated wire using same, method of making the wire and coaxial cableKATO YOSHIHISA·Filed 2008·Granted May 13, 2014·0 cites·15 claims
- 2856US6878448B2Epoxy resin composition for semiconductor encapsulation and semiconductor device using the sameHITACHI LTD·Filed 2001·Granted Apr 12, 2005·6 cites·46 claims
- 2955US4759958AMethod for forming polyimide film by chemical vapor depositionHITACHI LTD·Filed 1987·Granted Jul 26, 1988·23 cites·7 claims
- 3054US6504591B1Liquid crystal display apparatusHITACHI LTD·Filed 1998·Granted Jan 7, 2003·16 cites·25 claims
- 3153US2007029925A1Glass memberNAITOU TAKASHI·Filed 2006·Application pending·0 cites
- 3252US7375155B2Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereofHITACHI LTD·Filed 2005·Granted May 20, 2008·0 cites·6 claims
- 3352US7349049B2Liquid crystal display apparatusHITACHI LTD·Filed 2006·Granted Mar 25, 2008·0 cites·8 claims
- 3451US6682783B1Active matrix type liquid crystal display apparatusHITACHI LTD·Filed 1998·Granted Jan 27, 2004·14 cites·11 claims
- 3551US6015596AFluorine-containing silicon network polymer, insulating coating thereof, and electronic devices therewithHITACHI LTD·Filed 1996·Granted Jan 18, 2000·15 cites·32 claims
- 3647US2007044514A1Glass member and production process thereofNAITOU TAKASHI·Filed 2006·Application pending·0 cites
- 3746US7189439B2Active matrix type liquid crystal display apparatusHITACHI LTD·Filed 2003·Granted Mar 13, 2007·1 cites·33 claims
- 3846US6291619B1Photosensitive resin composition, method for forming pattern therefrom, electronic devices produced by using the same, and method for production thereofHITACHI CHEMICAL CO LTD·Filed 1998·Granted Sep 18, 2001·12 cites·7 claims
- 3946US2011079416A1Hydrous water absorbent polymer-dispersed ultraviolet curable resin composition, porous substance, and insulated wire cable using the sameHITACHI CABLE·Filed 2010·Application pending·0 cites
- 4045US10047202B2Resin-containing sheet, and structure and wiring board using sameASAHI CHEMICAL IND·Filed 2015·Granted Aug 14, 2018·0 cites·6 claims
- 4145US2012090871A1Hydrous water absorbent polymer dispersed ultraviolet curable resin composition, insulated electric wire using the same, method for producing the wire, and coaxial cableKATO YOSHIHISA·Filed 2011·Application pending·0 cites
- 4244US6418260B1Optical fiber and fiber-optic sensing system using the sameHITACHI LTD·Filed 1999·Granted Jul 9, 2002·10 cites·10 claims
- 4344US2006063009A1Glass memberNAITOU TAKASHI·Filed 2005·Application pending·0 cites
- 4444US2006063006A1Glass member and production process thereofNAITOU TAKASHI·Filed 2005·Application pending·0 cites
- 4543US5686191AThin film wiring boardHITACHI LTD·Filed 1995·Granted Nov 11, 1997·8 cites·6 claims
- 4643US5570506AMethod for forming multilayer wiring constructionHITACHI LTD·Filed 1995·Granted Nov 5, 1996·14 cites·3 claims
- 4743US5133989AProcess for producing metal-polyimide composite articleHITACHI LTD·Filed 1989·Granted Jul 28, 1992·12 cites·16 claims
- 4842US7088412B2Liquid crystal display apparatusHITACHI LTD·Filed 2003·Granted Aug 8, 2006·0 cites·11 claims
- 4941US2004246692A1Electronic circuit componentFiled 2002·Application pending·0 cites
- 5040US5238132AGlass pressure-vessel for a cathode ray tubeNIPPON SHEET GLASS CO LTD·Filed 1992·Granted Aug 24, 1993·6 cites·9 claims
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →