Inventor · disambiguated record
Takashi Miyajima
Also filed as: MIYAJIMA TAKASHI
18 granted patents·6 pending applications·148 citations·filing 1993–2020
94Inventor score
Files withRENESAS TECH CORP5MITSUBISHI ELECTRIC CORP4ASAHI GLASS CO LTD3DAIDO STEEL CO LTD2ELPIDA MEMORY INC2
Top patents by PatentIndex Score
24 records- 0183US6562887B1Polycarbonate resin compositionMITSUBISHI ENG PLASTICS CORP·Filed 2000·Granted May 13, 2003·19 cites·13 claims
- 0282US7125260B2Mounting structure of connectorSONY CORP·Filed 2005·Granted Oct 24, 2006·27 cites·10 claims
- 0372US6717824B2Printed wiring board unit, auxiliary substrate for hierarchical mounting, and electronic apparatusFUJITSU LTD·Filed 2001·Granted Apr 6, 2004·23 cites·11 claims
- 0471US6495418B2Method of manufacturing a semiconductor device having a capacitorMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Dec 17, 2002·11 cites·2 claims
- 0569US8723244B2Semiconductor device having storage electrode and manufacturing method thereofMIYAJIMA TAKASHI·Filed 2009·Granted May 13, 2014·5 cites·20 claims
- 0667US5914071ADifluoroethylene compounds and liquid crystal compositions containing themASAHI GLASS CO LTD·Filed 1997·Granted Jun 22, 1999·9 cites·4 claims
- 0764US6768154B2Semiconductor deviceRENESAS TECH CORP·Filed 2003·Granted Jul 27, 2004·11 cites·6 claims
- 0863US9331138B2Semiconductor device having storage electrode and manufacturing method thereofPS4 LUXCO SARL·Filed 2014·Granted May 3, 2016·1 cites·12 claims
- 0962US6534786B2Semiconductor device having a test element, and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Mar 18, 2003·8 cites·5 claims
- 1062US6521933B2Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Feb 18, 2003·8 cites·10 claims
- 1157US6756267B2Method of manufacturing a semiconductor device including a capacitor with a roughened-surface electrodeRENESAS TECH CORP·Filed 2002·Granted Jun 29, 2004·4 cites·3 claims
- 1256US6949786B2Semiconductor device including capacitorRENESAS TECH CORP·Filed 2003·Granted Sep 27, 2005·5 cites·7 claims
- 1347US6567260B1Capacitor and semiconductor memoryMITSUBISHI ELECTRIC CORP·Filed 2002·Granted May 20, 2003·1 cites·3 claims
- 1447US5603167AOil removing apparatus and oil removing method for a pipe coilDAIDO STEEL CO LTD·Filed 1994·Granted Feb 18, 1997·6 cites·14 claims
- 1547US2024017283A1Transfer pin and transfer deviceFUJI CORP·Filed 2020·Application pending·0 cites
- 1645US2006069923A1Authentication system using biological informationFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1743US2004219748A1Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2004·Application pending·0 cites
- 1839US5663463ADifluoroethylene compounds and liquid crystal compositions containing themASAHI GLASS CO LTD·Filed 1996·Granted Sep 2, 1997·5 cites·6 claims
- 1938US2005009346A1Method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 2036US8260376B2Information processing apparatusTANIMOTO FUMIHIKO·Filed 2008·Granted Sep 4, 2012·0 cites·9 claims
- 2135US5516949ADifluoroethylene compounds and liquid crystal compositions containing themASAHI GLASS CO LTD·Filed 1993·Granted May 14, 1996·3 cites·1 claims
- 2231US5784803AOil removing method for a pipe coilDAIDO STEEL CO LTD·Filed 1996·Granted Jul 28, 1998·2 cites·2 claims
- 2330US2011042733A1Semiconductor device and method of forming the sameELPIDA MEMORY INC·Filed 2010·Application pending·0 cites
- 2426US2010176486A1Semiconductor device and method of manufacturing the sameELPIDA MEMORY INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →