Inventor · disambiguated record
Takeshi Miyakawa
Also filed as: MIYAKAWA TAKESHI
48 granted patents·10 pending applications·233 citations·filing 1994–2020
98Inventor score
Top patents by PatentIndex Score
58 records- 0192US7291866B2Semiconductor light emitting device and semiconductor light emitting unitTOSHIBA KK·Filed 2005·Granted Nov 6, 2007·31 cites·20 claims
- 0291US10358704B2Composite body and method for manufacturing sameDENKA COMPANY LTD·Filed 2015·Granted Jul 23, 2019·5 cites·6 claims
- 0383US9275921B2Semiconductor deviceTOSHIBA KK·Filed 2014·Granted Mar 1, 2016·6 cites·20 claims
- 0482US10636723B2Heat dissipation component and method for manufacturing sameDENKA COMPANY LTD·Filed 2015·Granted Apr 28, 2020·1 cites·4 claims
- 0581US9872380B2Ceramic circuit board and method for producing sameDENKA COMPANY LTD·Filed 2015·Granted Jan 16, 2018·2 cites·4 claims
- 0678US10640853B2Aluminum-diamond-based composite and heat dissipation componentDENKA COMPANY LTD·Filed 2016·Granted May 5, 2020·1 cites·17 claims
- 0777US6485832B1Resin composition, molded product thereof and electroconductive sheetDENKI KAGAKU KOGYO KK·Filed 2000·Granted Nov 26, 2002·10 cites·44 claims
- 0873US9362192B2Semiconductor device comprising heat dissipating connectorTOSHIBA KK·Filed 2014·Granted Jun 7, 2016·4 cites·20 claims
- 0973US8148456B2Conductive resin composition and conductive sheets comprising the sameAOKI YUTAKA·Filed 2007·Granted Apr 3, 2012·1 cites·22 claims
- 1069US7794807B2Conductive composite sheetingDENKI KAGAKU KOGYO KK·Filed 2005·Granted Sep 14, 2010·1 cites·15 claims
- 1168US10869413B2Heat-dissipating component and method for manufacturing sameDENKA COMPANY LTD·Filed 2015·Granted Dec 15, 2020·2 cites·4 claims
- 1268US7832797B2Foldable furnitureMIYAKAWA TAKESHI·Filed 2007·Granted Nov 16, 2010·2 cites·8 claims
- 1368USD575081STableMIYAKAWA TAKESHI·Filed 2007·Granted Aug 19, 2008·15 cites·1 claims
- 1467US10541189B2Heat dissipation component for semiconductor elementDENKA COMPANY LTD·Filed 2017·Granted Jan 21, 2020·1 cites·8 claims
- 1564US7014896B1Packaging container for electronic partDENKI KAGAKU KOGYO KK·Filed 2000·Granted Mar 21, 2006·12 cites·11 claims
- 1664US6960390B2Resin composition, molded product thereof and electroconductive sheetDENKI KAGAKU KOGYO KK·Filed 2003·Granted Nov 1, 2005·2 cites·30 claims
- 1763US10751912B2Aluminum-diamond-based composite and method for producing sameDENKA COMPANY LTD·Filed 2016·Granted Aug 25, 2020·1 cites·9 claims
- 1863US9171817B2Semiconductor deviceTOSHIBA KK·Filed 2013·Granted Oct 27, 2015·1 cites·6 claims
- 1962US10919811B2Aluminum-silicon-carbide composite and method of manufacturing sameDENKA COMPANY LTD·Filed 2015·Granted Feb 16, 2021·1 cites·4 claims
- 2062US10302375B2Aluminum-diamond composite, and heat dissipating component using sameDENKA COMPANY LTD·Filed 2015·Granted May 28, 2019·1 cites·5 claims
- 2161US7455896B2Electronic component containerDENKI KAGAKU KOGYO KK·Filed 2002·Granted Nov 25, 2008·8 cites·9 claims
- 2260US5747164AConductive composite plastic sheet and containerDENKI KAGAKU KOGYO KK·Filed 1995·Granted May 5, 1998·27 cites·11 claims
- 2360US2007082178A1Sheet for embossed carrier tapeDENKI KAGAKU KOGYO KK·Filed 2006·Application pending·0 cites
- 2459US11682604B2Heat dissipation component and method for manufacturing sameDENKA COMPANY LTD·Filed 2020·Granted Jun 20, 2023·0 cites·6 claims
- 2559US11296008B2Aluminum-silicon carbide composite and production method thereforDENKA COMPANY LTD·Filed 2015·Granted Apr 5, 2022·1 cites·8 claims
- 2658US6759130B2Resin composition, molded product thereof and electroconductive sheetDENKI KAGAKU KOGYO KK·Filed 2002·Granted Jul 6, 2004·5 cites·24 claims
- 2758US5707699AElectroconductive resin composition, sheet, molded product and containerDENKI KAGAKU KOGYO KK·Filed 1997·Granted Jan 13, 1998·12 cites·6 claims
- 2857US8449143B2Metal base circuit boardMIYAKAWA TAKESHI·Filed 2008·Granted May 28, 2013·1 cites·23 claims
- 2957US8440305B2Electrically conductive sheetAOKI YUTAKA·Filed 2007·Granted May 14, 2013·0 cites·20 claims
- 3056USD571114SChairMIYAKAWA TAKESHI·Filed 2007·Granted Jun 17, 2008·9 cites·1 claims
- 3156US7364778B2Container for an electronic componentDENKI KAGAKU KOGYO KK·Filed 2002·Granted Apr 29, 2008·7 cites·37 claims
- 3256US5415906AHeat resistant electrically conductive plastic sheet and containerDENKI KAGAKU KOGYO KK·Filed 1994·Granted May 16, 1995·25 cites·14 claims
- 3355US10081055B2Composite body and method for producing sameDENKA COMPANY LTD·Filed 2015·Granted Sep 25, 2018·0 cites·13 claims
- 3454US11332623B2Carbon black, electrode catalyst and fuel cell using same, and method for producing carbon blackUNIV YAMANASHI·Filed 2016·Granted May 17, 2022·0 cites·13 claims
- 3554US8796145B2Method of manufacturing metal-base substrate and method of manufacturing circuit boardNISHI TAIKI·Filed 2011·Granted Aug 5, 2014·2 cites·10 claims
- 3653USD580668SChairMIYAKAWA TAKESHI·Filed 2007·Granted Nov 18, 2008·8 cites·1 claims
- 3751US8426740B2Metal base circuit boardNISHI TAIKI·Filed 2009·Granted Apr 23, 2013·1 cites·4 claims
- 3851US5876632AElectroconductive resin composition, sheet, molded product and containerDENKI KAGAKU KOGYO KK·Filed 1997·Granted Mar 2, 1999·10 cites·11 claims
- 3950US7199187B2SheetDENKI KAGAKU KOGYO KK·Filed 2002·Granted Apr 3, 2007·0 cites·13 claims
- 4048US7097900B2Sheet and electronic component packaging containerDENKI KAGAKU KOGYO KK·Filed 2002·Granted Aug 29, 2006·3 cites·24 claims
- 4146USD609031STableMIYAKAWA TAKESHI·Filed 2008·Granted Feb 2, 2010·5 cites·1 claims
- 4245US5955164AElectroconductive resin composition, sheet, molded product and containerDENKI KAGAKU KOGYO KK·Filed 1998·Granted Sep 21, 1999·7 cites·8 claims
- 4345US2015221582A1Connector frame and semiconductor deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 4444US2015076674A1Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2014·Application pending·0 cites
- 4542US10529591B2Method for producing silicon carbide composite materialDENKA COMPANY LTD·Filed 2015·Granted Jan 7, 2020·0 cites·12 claims
- 4642US2005124739A1Sheet and formed product thereofDENKI KAGAKU KOGYO KK·Filed 2003·Application pending·0 cites
- 4742US2010027261A1Led light source unitDENKI KAGAKU KOGYO KK·Filed 2007·Application pending·0 cites
- 4840US2006157722A1Semiconductor light emitting deviceTOSHIBA KK·Filed 2005·Application pending·0 cites
- 4938US2003070961A1Sheet for embossed carrier tapeFiled 2000·Application pending·0 cites
- 5036US2017069563A1Semiconductor package and method of manufacturing semiconductor packageTOSHIBA KK·Filed 2016·Application pending·0 cites
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →