Inventor · disambiguated record
Takuya Miyakawa
Also filed as: MIYAKAWA TAKUYA
35 granted patents·12 pending applications·641 citations·filing 1994–2023
97Inventor score
Top patents by PatentIndex Score
47 records- 0198US6006763ASurface treatment methodSEIKO EPSON CORP·Filed 1998·Granted Dec 28, 1999·175 cites·8 claims
- 0290US6086710ASurface treatment apparatusSEIKO EPSON CORP·Filed 1996·Granted Jul 11, 2000·84 cites·18 claims
- 0390US5735451AMethod and apparatus for bonding using brazing materialSEIKO EPSON CORP·Filed 1994·Granted Apr 7, 1998·58 cites·58 claims
- 0487US9989810B2Electro-optical device and electronic apparatusSEIKO EPSON CORP·Filed 2016·Granted Jun 5, 2018·2 cites·16 claims
- 0587US5918354AMethod of making a piezoelectric elementSEIKO EPSON CORP·Filed 1997·Granted Jul 6, 1999·68 cites·13 claims
- 0686US9470932B2Electro-optical device and electronic apparatusSEIKO EPSON CORP·Filed 2015·Granted Oct 18, 2016·2 cites·12 claims
- 0780US6158648AMethod and apparatus for bonding using brazing materialSEIKO EPSON CORP·Filed 1998·Granted Dec 12, 2000·39 cites·37 claims
- 0879US6051150APlasma etching method and method of manufacturing liquid crystal display panelSEIKO EPSON CORP·Filed 1996·Granted Apr 18, 2000·53 cites·4 claims
- 0978US11798738B2Magnetic powder, method for producing magnetic powder, powder magnetic core, and coil partSEIKO EPSON CORP·Filed 2020·Granted Oct 24, 2023·1 cites·12 claims
- 1076US6620282B2Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agentSEIKO EPSON CORP·Filed 2001·Granted Sep 16, 2003·11 cites·10 claims
- 1176US6221197B1Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agentSEIKO EPSON CORP·Filed 1998·Granted Apr 24, 2001·30 cites·32 claims
- 1274US7098121B2Method of forming a film of predetermined pattern on a surface as well as device manufactured by employing the same, and method of manufacturing deviceSEIKO EPSON CORP·Filed 2003·Granted Aug 29, 2006·16 cites·32 claims
- 1372US9205678B2Ink jet printerSEIKO EPSON CORP·Filed 2015·Granted Dec 8, 2015·1 cites·16 claims
- 1469US10353248B2Electro-optical device and electronic apparatusSEIKO EPSON CORP·Filed 2018·Granted Jul 16, 2019·0 cites·16 claims
- 1569US6342275B1Method and apparatus for atmospheric pressure plasma surface treatment, method of manufacturing semiconductor device, and method of manufacturing ink jet printing headSEIKO EPSON CORP·Filed 1994·Granted Jan 29, 2002·41 cites·3 claims
- 1668US12189345B2Atomic cell, method for manufacturing atomic cell, and quantum interference deviceSEIKO EPSON CORP·Filed 2023·Granted Jan 7, 2025·0 cites·19 claims
- 1768US7344221B2Head member, method for ink-repellent treatment and apparatus for the sameSEIKO EPSON CORP·Filed 2005·Granted Mar 18, 2008·2 cites·2 claims
- 1863US7148148B2Mask forming and removing method, and semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same methodSEIKO EPSON CORP·Filed 2002·Granted Dec 12, 2006·8 cites·23 claims
- 1962US12350738B2Method for manufacturing coated metal powderSEIKO EPSON CORP·Filed 2022·Granted Jul 8, 2025·0 cites·9 claims
- 2062US10865062B2Medium transport device, printing apparatus, and method for manufacturing medium transport deviceSEIKO EPSON CORP·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 2162US6183883B1Brazing or soldering material and manufacturing method thereforSEIKO EPSON CORP·Filed 1998·Granted Feb 6, 2001·19 cites·22 claims
- 2261US10396809B2Atomic cell, atomic cell manufacturing method, quantum interference device, atomic oscillator, electronic apparatus, and vehicleSEIKO EPSON CORP·Filed 2017·Granted Aug 27, 2019·1 cites·10 claims
- 2359US10604859B2Method for forming pattern, method for manufacturing ornament, method for manufacturing belt for wristwatch, method for manufacturing structure for mounting wiring, method for manufacturing semiconductor device, and method for manufacturing printed circuit boardSEIKO EPSON CORP·Filed 2017·Granted Mar 31, 2020·0 cites·18 claims
- 2459US6604672B2Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agentSEIKO EPSON CORP·Filed 2001·Granted Aug 12, 2003·3 cites·11 claims
- 2557US2008221346A1Oriented-film formation apparatus and oriented filmSEIKO EPSON CORP·Filed 2008·Application pending·0 cites
- 2656US2023400813A1Watch Component, Watch, And Method For Manufacturing Watch ComponentSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 2754US10399340B2Nozzle plate, liquid ejecting head, liquid ejecting apparatus, and method of manufacturing nozzle plateSEIKO EPSON CORP·Filed 2018·Granted Sep 3, 2019·0 cites·20 claims
- 2853US6923525B2Head member ink repellence treating method and treating deviceSEIKO EPSON CORP·Filed 2001·Granted Aug 2, 2005·4 cites·10 claims
- 2953US6332567B1Piezoelectric element, manufacturing method thereof, and mounting apparatus of piezoelectric resonatorsSEIKO EPSON CORP·Filed 1997·Granted Dec 25, 2001·13 cites·8 claims
- 3051US2007015070A1Manufacturing apparatus for oriented film, liquid crystal device, and electronic deviceSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 3150US7238615B2Formation method for metal element, production method for semiconductor device, production method for electronic device, semiconductor device, electronic device, and electronic equipmentSEIKO EPSON CORP·Filed 2003·Granted Jul 3, 2007·2 cites·9 claims
- 3249US7332034B2Coating apparatus and coating method using the sameSEIKO EPSON CORP·Filed 2004·Granted Feb 19, 2008·3 cites·5 claims
- 3347US2023116387A1HIGH-PURITY PURIFICATION TECHNIQUE FOR Gc PROTEINKK MEDICALBIARA·Filed 2021·Application pending·0 cites
- 3446US9216593B2Ink jet printer and control method thereofSEIKO EPSON CORP·Filed 2015·Granted Dec 22, 2015·0 cites·9 claims
- 3546US7291281B2Head member, method for ink-repellent treatment and apparatus for the sameSEIKO EPSON CORP·Filed 2005·Granted Nov 6, 2007·0 cites·3 claims
- 3645US2018241408A1Quantum interference device, atomic oscillator, and electronic apparatusSEIKO EPSON CORP·Filed 2018·Application pending·0 cites
- 3744US2010128212A1Manufacturing apparatus for oriented film, manufacturing method for oriented film, liquid crystal device, and electronic deviceSEIKO EPSON CORP·Filed 2010·Application pending·0 cites
- 3843US2002007878A1Carbide dispersed, strengthened copper alloyYAZAKI CORP·Filed 2001·Application pending·0 cites
- 3942US2007014937A1Manufacturing apparatus for oriented film, manufacturing method for oriented film, liquid crystal device, and electronic deviceSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 4040US7163638B2Method for forming a transparent electrode filmSEIKO EPSON CORP·Filed 2004·Granted Jan 16, 2007·0 cites·8 claims
- 4140US2005003090A1Method of forming pattern of transparent conductive filmFiled 2004·Application pending·0 cites
- 4239US9475312B2Ink jet printer and printing methodSEIKO EPSON CORP·Filed 2015·Granted Oct 25, 2016·0 cites·16 claims
- 4339US2004161539A1Method and apparatus for forming porous insulating layer and electronic device manufactured using the methodFiled 2003·Application pending·0 cites
- 4436US2004209190A1Pattern forming method and apparatus used for semiconductor device, electric circuit, display module, and light emitting deviceFiled 2001·Application pending·0 cites
- 4535US2018241407A1Quantum interference device, atomic oscillator, and electronic apparatusSEIKO EPSON CORP·Filed 2018·Application pending·0 cites
- 4633US6180253B1Brazing or soldering material and production method thereofSEIKO EPSON CORP·Filed 1998·Granted Jan 30, 2001·3 cites·20 claims
- 4730US6299708B1Carbide dispersed, strengthened copper alloyYAZAKI CORP·Filed 1998·Granted Oct 9, 2001·2 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →