Inventor · disambiguated record
Takaaki Miyamoto
Also filed as: MIYAMOTO TAKAAKI
30 granted patents·8 pending applications·441 citations·filing 1995–2022
97Inventor score
Top patents by PatentIndex Score
38 records- 0194US7470004B2Liquid ejection head and liquid ejection deviceSONY CORP·Filed 2005·Granted Dec 30, 2008·16 cites·15 claims
- 0286US5831335ASemiconductor device contains refractory metal or metal silicide with less than 1% weight of halogen atomSONY CORP·Filed 1996·Granted Nov 3, 1998·67 cites·7 claims
- 0383US5747384AProcess of forming a refractory metal thin filmSONY CORP·Filed 1995·Granted May 5, 1998·61 cites·4 claims
- 0482US6380065B1Interconnection structure and fabrication process thereforSONY CORP·Filed 1999·Granted Apr 30, 2002·69 cites·8 claims
- 0581US7690768B2Liquid ejecting head and liquid ejecting apparatusSONY CORP·Filed 2007·Granted Apr 6, 2010·6 cites·8 claims
- 0679US6040021APlasma CVD process for metal films and metal nitride filmsSONY CORP·Filed 1997·Granted Mar 21, 2000·51 cites·28 claims
- 0778US6536877B2Printer, printer head, and method for fabricating printer head formed with a multilayer wiring patternSONY CORP·Filed 2001·Granted Mar 25, 2003·18 cites·7 claims
- 0875US7537311B2Method and apparatus for ejecting liquidSONY CORP·Filed 2006·Granted May 26, 2009·3 cites·3 claims
- 0969US7410247B2Liquid ejection head and liquid ejection apparatusSONY CORP·Filed 2005·Granted Aug 12, 2008·3 cites·23 claims
- 1069US7334878B2Liquid ejection head and liquid ejection apparatusSONY CORP·Filed 2005·Granted Feb 26, 2008·3 cites·7 claims
- 1160US6685304B2Printer, printer head and method of producing the print head to promote reliable bonding of print head structuresSONY CORP·Filed 2001·Granted Feb 3, 2004·8 cites·19 claims
- 1259US7028402B2Method of manufacturing a liquid dispenserSONY CORP·Filed 2004·Granted Apr 18, 2006·6 cites·3 claims
- 1355US6331485B1Method of producing semiconductor deviceSONY CORP·Filed 1996·Granted Dec 18, 2001·17 cites·8 claims
- 1455US6143377AProcess of forming a refractory metal thin filmSONY CORP·Filed 1998·Granted Nov 7, 2000·17 cites·14 claims
- 1555US6114764ASemiconductor device and process for fabricating the sameSONY CORP·Filed 1996·Granted Sep 5, 2000·19 cites·6 claims
- 1653US6284649B1Chemical vapor phase growing method of a metal nitride film and a method of manufacturing an electronic device using the sameSONY CORP·Filed 1999·Granted Sep 4, 2001·18 cites·22 claims
- 1753US5981388APlasma CVD method for forming a semiconductor device having metal film formed therebySONY CORP·Filed 1997·Granted Nov 9, 1999·17 cites·10 claims
- 1851US2009096841A1Liquid ejection head and liquid ejection deviceSONY CORP·Filed 2008·Application pending·0 cites
- 1950US2009040280A1Liquid ejecting head and liquid ejecting deviceSONY CORP·Filed 2008·Application pending·0 cites
- 2050US2023014575A1Layout creation device, layout creation method, learning model generation device, and learning model generation methodMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2149US5840628APlasma CVD method for depositing tin layerSONY CORP·Filed 1995·Granted Nov 24, 1998·15 cites·21 claims
- 2247US6624062B2Wiring structure in semiconductor device and method for forming the sameSONY CORP·Filed 2001·Granted Sep 23, 2003·2 cites·3 claims
- 2346US7836598B2Method of manufacturing a thermal liquid jet head using an etching processSONY CORP·Filed 2005·Granted Nov 23, 2010·0 cites·2 claims
- 2446US6773091B2Liquid discharge device and method of manufacturing the sameSONY CORP·Filed 2002·Granted Aug 10, 2004·3 cites·2 claims
- 2546US2007058002A1Liquid jetting head, liquid jetting apparatus, and method of manufacturing the liquid jetting headMIYAMOTO TAKAAKI·Filed 2006·Application pending·0 cites
- 2644US7261393B2Liquid jetting head, liquid jetting apparatus, and method of manufacturing the liquid jetting headSONY CORP·Filed 2004·Granted Aug 28, 2007·2 cites·3 claims
- 2744US6592209B2Printer, printer head, and method of producing the printer headSONY CORP·Filed 2001·Granted Jul 15, 2003·2 cites·17 claims
- 2844US5962084APlasma CVD process and semiconductor device having metal film formed by the processSONY CORP·Filed 1996·Granted Oct 5, 1999·11 cites·13 claims
- 2942US7431430B2Liquid ejecting head having selectively controlled heat-energy evolving element regionsSONY CORP·Filed 2003·Granted Oct 7, 2008·1 cites·11 claims
- 3040US7182440B2Liquid jet apparatusSONY CORP·Filed 2002·Granted Feb 27, 2007·0 cites·12 claims
- 3140US2002127851A1Method of producing semiconductor deviceFiled 2001·Application pending·0 cites
- 3239US2006243701A1Liquid discharge head and liquid discharge head manufacturing method, chip element, and printing apparatusONO SHOGO·Filed 2006·Application pending·0 cites
- 3338US6337515B1Wiring structure in semiconductor device and method for forming the sameSONY CORP·Filed 1999·Granted Jan 8, 2002·6 cites·6 claims
- 3437US6848770B2Liquid dispenser and printerSONY CORP·Filed 2003·Granted Feb 1, 2005·0 cites·3 claims
- 3536US7066571B2Liquid ejection apparatusSONY CORP·Filed 2003·Granted Jun 27, 2006·0 cites·20 claims
- 3635US6513912B2Heat generating element for printer head and manufacturing method thereforSONY CORP·Filed 2001·Granted Feb 4, 2003·0 cites·7 claims
- 3734US2006044354A1Liquid discharge head, liquid discharge device, and method for manufacturing liquid discharge headMIYAMOTO TAKAAKI·Filed 2004·Application pending·0 cites
- 3833US2007153064A1Liquid ejection head, liquid ejector and process for manufacturing liquid ejection headMIYAMOTO TAKAAKI·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →