Inventor · disambiguated record
Takaaki Mizuno
Also filed as: MIZUNO TAKAAKI
8 granted patents·3 pending applications·6 citations·filing 2015–2025
75Inventor score
Files withMURATA MANUFACTURING CO8MITSUI KINZOKU ACT CORP1SEKISUI CHEMICAL CO LTD1SEKISUI POLYMATECH CO LTD1
Top patents by PatentIndex Score
11 records- 0177US10287806B2Latch device for trunk lid of vehicleMITSUI KINZOKU ACT CORP·Filed 2015·Granted May 14, 2019·4 cites·10 claims
- 0275US10397708B2Piezoelectric element, piezoelectric microphone, piezoelectric resonator and method for manufacturing piezoelectric elementMURATA MANUFACTURING CO·Filed 2018·Granted Aug 27, 2019·2 cites·12 claims
- 0362US2025118659A1Electronic componentMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0459US12315682B2Passive component and package componentMURATA MANUFACTURING CO·Filed 2023·Granted May 27, 2025·0 cites·19 claims
- 0558US11012787B2Piezoelectric element, piezoelectric microphone, piezoelectric resonator and method for manufacturing piezoelectric elementMURATA MANUFACTURING CO·Filed 2019·Granted May 18, 2021·0 cites·5 claims
- 0656US12122916B2Silicone composition and curable greaseSEKISUI POLYMATECH CO LTD·Filed 2020·Granted Oct 22, 2024·0 cites·13 claims
- 0754US2023395309A1Electronic component and method of manufacturing electronic componentMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 0853US11451211B2Gallium nitride structure, piezoelectric element, method of manufacturing piezoelectric element, and resonator using piezoelectric elementMURATA MANUFACTURING CO·Filed 2018·Granted Sep 20, 2022·0 cites·19 claims
- 0946US12384950B2Heat-dissipating composition, heat-dissipating member, and filler aggregate for heat-dissipating memberSEKISUI CHEMICAL CO LTD·Filed 2019·Granted Aug 12, 2025·0 cites·18 claims
- 1045US2025150050A1Electronic componentMURATA MANUFACTURING CO·Filed 2025·Application pending·0 cites
- 1143US11107637B2Variable capacitance elementMURATA MANUFACTURING CO·Filed 2019·Granted Aug 31, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →